Hardware

• ARM Cortex-M4
• Core Processor Compliant with 3GPP^TM Rel.14 NB-IoT standard
• Integrated with WISE-PaaS/RMM & MBED Cloud Service
• Rich interface for sensor and I/O control
• Support wide temperature: -40°C to 85°C

• Low cost through high integration combining MCU, PMU, Flash, RAM, DSP, RF, and other units in one module
• Small size combined with rich peripheral interface
• Global band support for worldwide products (617 MHz to 2.2 GHz)
• Low power consumption (~3uA in PSM)
• Operating temperature range of -40°C to 85°C

• Low-cost satellite connectivity network providing the highest value for money in the market
• Miniaturized patch antennas enabled by L-Band spectrum
• Discrete antennas with better performance
• Two-way communications – send instructions to your device as well as collecting data from your device
• Ultra-low power terminals – 0.35 Watt at transmission, enabling 10 years maintenance-free operation

• Support for LTE Cat.NB2
• Available in LCC+LGA form factor with integrated eSIM solution.
• 6-band support for regional deployments
• Firmware over the Air updates via LwM2M

• Ultra-Small: 16 x 18 x 2.55 mm³
• LCC package
• Ultra-low sleep power
• Extended temperature range: -35°C to +75°C at full performance, -40°C to +85°C at reduced performance

• LTE-A Cat 12 module with M.2 form factor
• Support DL 3 Carrier Aggregation and 256QAM
• Worldwide LTE-A and UMTS/ HSPA+ coverage
• Built-in eSIM (optional), DSSA
• Low power mode
• Multi-constellation GNSS receiver available for applications requiring fast and accurate fixes in any environment
• MIMO technology meets demands for data rate and link reliability in modem wireless communication systems

• 3G/LTE/5G Cat.19 LGA module based on the Mediatek T750 chipset
• Both 5G modes: NSA and SA supported
• Supports a wide range of supported LTE/5G NR frequency bands commonly used in different regions of the world
• Downlink/Uplink MIMO (4x4/2x2), EN-DC/LTE carrier aggregations
• Multi-constellation GNSS receiver available for applications requiring fast and accurate fixes in any environment
• Backwards compatible module, to help facilitate the migration and differentiation between LTE and 5G

• MTK MT6880 ARM Cortex-A55 up to 1.5 GHz
• 5G Sub-6 FDD and TDD and SA & NSA operations
• Downlink

■ LTE CAT19, MAX 5CC, Peak Rate: 1.6Gbps

■ 5G Sub-6G: NR 2CC + LTE 4CC, Peak Rate: 4.53 Gbps

• Uplink

■ LTE CAT18, MAX 2CC, Peak Rate: 211 Mbps

■ 5G Sub-6G: NR 1CC + LTE 2CC, Peak Rate: 836 Mbps

• Rich NR Carrier Aggregation
• Driver support for Linux, Windows

• 3G/LTE/5G Cat.20 M.2 module based on the Qualcomm SDX55 Cortex-A7 chipset
• Both 5G modes: NSA and SA supported
• Supports a wide range of supported LTE/5G NR frequency bands commonly used in different regions of the world
• Downlink/Uplink MIMO (4x4/2x2), EN-DC/LTE carrier aggregations
• Multi-constellation GNSS receiver available for applications requiring fast and accurate fixes in any environment
• Backwards compatible module, to help facilitate the migration and differentiation between LTE and 5G

• LGA form factor LTE advanced category 6 wireless communication module
• Supports 3 modes of LTE-TDD/LTE-FDD/WCDMA
• Peak data rates can reach 300Mbps downlink and 50Mbps uplink
• Can cover Europe, APAC, Australia mobile network and be used in industries such as CPE, STB, industrial 4.0 and Internet of vehicles.

• 5G/LTE CAT-16 M.2 data card module based on the SDX55 Qualcomm chipset
• Supports a wide range of supported LTE frequency bands commonly used in many different regions of the world
• Downlink MIMO, carrier aggregations 3CA
• 5G SA / NSA network architecture support

• Supports 5G SA and NSA for versatile deployment
• MTK T830 chip with 4nm tech ensures high performance and efficiency
• Two 10Gbps USXGMII ports deliver ultra-fast data speeds
• Sub-6GHz with 4CC CA offers wide coverage and strong connectivity
• All-in-one solution for CPE, FWA, routers and industrial use

• LGA form factor wireless communication module
• LTE-FDD/LTE-TDD/WCDMA support
• The high speed Cat.6 module can reach up to 400Mbps DL and 50Mbps UL
• It can be widely used in CPE and STB gateway industry
• Can cover EMEA/APAC/Australian mobile networks

• 3G/LTE Cat.6 M.2 module based on the Qualcomm SDX12-2 chipset
• Supports a wide range of supported 3G/LTE frequency bands commonly used in many different regions of the world
• The high speed LTE Cat.6 module can reach up to 300Mbps DL and 50Mbps UL
• Multi-constellation GNSS receiver available for applications requiring fast and accurate fixes in any environment

• 3G/LTE Cat.12 M.2 module based on the Qualcomm SDX12-0 chipset
• Supports a wide range of supported 3G/LTE frequency bands commonly used in many different regions of the world
• The high speed LTE Cat.12 module can reach up to 600Mbps DL and 150Mbps UL
• Multi-constellation GNSS receiver available for applications requiring fast and accurate fixes in any environment

• M.2 form factor LTE Advanced category 12 wireless communication module based on Qualcomm SDX12 chipset
• Supports 3 modes of LTE-TDD/LTE-FDD/WCDMA
• The peak data rates can reach 600Mbps downlink and 150Mbps uplink
• Can cover Global mobile network and provide perfect high-speed experience for PC, Laptop and Tablets customers

• 5G/LTE CAT-16 M.2 data card module based on the SDX55 Qualcomm chipset.
• Supports a wide range of supported LTE frequency bands commonly used in many different regions of the world.
• Downlink MIMO, carrier aggregations 3CA.
• 5G SA / NSA network architecture support.

• 5G/4G/3G multi-mode module with M.2 form factor, optimized for IoT and eMBB applications
• Both NSA and SA modes supported
• Supports a wide range of supported LTE/5G NR frequency bands commonly used in many different regions of the world
• Downlink/Uplink MIMO (4x4 / 2x2), EN-DC / LTE carrier aggregation
• Multi-constellation GNSS receiver available for applications requiring fast and accurate fixes in any environment
• Backwards compatible module, to help facilitate the migration and differentiation between 4G LTE and 5G

• 5G/LTE Cat.19 M.2 data card module based on the Mediatek M70 family chipset
• Supports a wide range of supported LTE/5G NR frequency bands commonly used in many different regions of the world
• Downlink/Uplink MIMO (4x4 / 2x2), EN-DC / LTE carrier aggregation
• Integrated GNSS receiver (GPS, GLONASS, BeiDou, QZSS, and Galileo satellite systems supported)
• Backwards compatible module, to help facilitate the migration and differentiation between 4G LTE and 5G

• FM350-GL-16 is a M.2 form factor LTE Advanced category 16 wireless communication module.
• It supports 3 modes of LTE-TDD/LTE-FDD/WCDMA.
• The peak data rates can reach 1Gbps downlink and 211Mbps uplink.
• IFM350-GL-16 can cover Global mobile network and provide perfect high-speed experience for PC, Laptop and Tablets customers.)

• Small ,Slim M.2 form factor (30x52x2.3mm)
• High speed data module, 5G NR Sub6 peak DL 4.67Gbps UL 1.25Gbps; NSA peak DL 3.74Gbps UL 835Mbps; LTE peak DL 1.6Gbps UL 211Mbps
• Rx diversity for 3G/4G/5G, support global band, up to 4x4 DL-MIMO & 256QAM
• GNSS support (GPS, GLONASS, BeiDou, Galileo, QZSS)
• Low power and low cost

• 2G / LTE Cat.1bis module optimized for M2M and IoT applications
• Universal interfaces such as USB / UART / SPI / I2C / SDIO
• Support for frequency bands of major operators in Europe
• VoLTE support
• Pin design is compatible with NL668 series / L716 series
• Ideal for medium and low rate communication solution

• 2G / LTE Cat.1bis module optimized for M2M and IoT applications
• Universal interfaces such as USB / UART / SPI / I2C / SDIO
• Support for frequency bands of major operators in Europe
• VoLTE support
• Pin design is compatible with NL668 series / L716 series
• Ideal for medium and low rate communication solution

• M.2 form factor high-end LTE wireless communication module
• LTE-FDD/LTE-TDD/WCDMA support
• Multiple CA band combinations
• The high speed Cat.9 module can reach up to 450Mbps DL and 50Mbps UL
• Can be widely used in consumer electronics and gateway industry

• M.2 form factor high-end LTE wireless communication module
• LTE-FDD/LTE-TDD/WCDMA support
• Multiple CA band combinations
• The high speed Cat.16 module can reach up 1 Gbps DL and 75Mbps UL
• Can be widely used in consumer electronics and gateway industry

• LTE Cat.16 M.2 data card module based on the Intel XMM7560 chipset
• Supports a wide range of supported LTE frequency bands commonly used in many different regions of the world
• Downlink MIMO, Carrier Aggregation 5CA Downlink and 2CA Uplink IntraBand
• 3GPP Rel.12 compatible
• Industry-standard design (42 mm x 30 mm x 2.3 mm)
• Widely used in consumer electronics, such as laptops, tablets, and gateway industries

• Ultimate size, supporting customers in achieving the demand for miniaturization of terminals
• Ultimate power consumption, catering to a wide range of battery-powered IoT applications
• Providing IoT industry reference designs and customer development support
• High-performance LTE Cat1 bis IoT modules, designed for low cost and offering exceptional cost-effectiveness

• Multimode, multi-band module with LTE-M (eMTC) + NB1 + EGPRS
• Power Saving Features, including 10 microAmps PSM mode
• Extended protocol support: PPP / TCP / UDP / FTP(S) / HTTP(S) / PING / NITZ
• Device Management over DFOTA, LwM2M

• Tri-mode for the global market: LTE Cat-M1/Cat-NB2/EGPRS
• Reliable and stable data transmission with ultra-low power consumption
• Global certifications
• Compatible with Fibocom 510-Series modules, easy for future upgrading

• Support multiple network frequency bands and rich Internet protocols
• Rich extension of interfaces allowing much flexibility and ease of integration for customer's applications
• Provide IoT industry reference design and timely technical support to help customers quickly complete product development
• VoLTE support
• High performance LTE Cat1 bis IoT module with ultra high cost performance

• Power saving features for extended battery life: PSM (less than 3.0uA) and eDRX
• Supports Release Assistance Indicator (RAI) to reduce power consumption
• Native support for multiple protocols, including IPV4, IPV6, CoAP, LwM2M
• Support for firmware updates via FOTA

• Compact LCC+LGA form factor 22.2 mm x 20.2 mm x 2.1 mm
• Broad protocol support: TCP/UDP, IPv4/IPv6, CoAP, LWM2M
• Advanced power saving features for long battery life: PSM, eDRX
• Device management using firmware over the air (FOTA)

• GNSS support
• Multimode LTE FDD & WCDMA &GSM
• Embedded TCP/UDP protocol stacks
• Embedded FTP/HTTP protocols
• USB 2.0 support
• 3GPP^TM Rel.9

• GNSS support
• Multimode LTE FDD & WCDMA &GSM
• Embedded TCP/UDP protocol stacks
• Embedded FTP/HTTP protocols
• USB 2.0 support
• 3GPP^TM Rel.9

• 3GPP^TM Rel.9 LTE Cat.4 module packaged in a LCC form factor
• Supports mulitple LTE FDD, WCDMA, and GSM frequency bands
• Embedded GNSS
• Integrated TCP/UDP stack, with support for FTP/HTTP
• USB 2.0

• 3GPP^TM Rel.9 LTE Cat.4 module packaged in a miniPCIe form factor
• Supports mulitple LTE FDD, WCDMA, and GSM frequency bands
• Embedded GNSS
• Integrated TCP/UDP stack, with support for FTP/HTTP
• USB 2.0

• 3G / LTE / 5G M.2 module based on the Qualcomm SDX72 chipset
• Both 5G modes: NSA and SA supported
• Supports a wide range of supported LTE/5G NR frequency bands commonly used in different regions of the world
• Downlink/Uplink MIMO (4x4 / 2x2), ENDC / NR / LTE carrier aggregations
• Multi-constellation GNSS receiver available for applications requiring fast and accurate fixes in any environment

• 3G / LTE / 5G M.2 module based on the Qualcomm SDX65 chipset
• Both 5G modes: NSA and SA supported
• Supports a wide range of supported LTE/5G NR frequency bands commonly used in different regions of the world
• Downlink/Uplink MIMO (4x4/2x2), EN-DC/LTE carrier aggregations
• Multi-constellation GNSS receiver available for applications requiring fast and accurate fixes in any environment

• 3G / LTE / 5G M.2 module based on the Qualcomm SDX62 chipset
• Both 5G modes: NSA and SA supported
• Supports a wide range of supported LTE/5G NR frequency bands commonly used in different regions of the world
• Downlink/Uplink MIMO (4x4/2x2), EN-DC/LTE carrier aggregations
• Multi-constellation GNSS receiver available for applications requiring fast and accurate fixes in any environment

• Supports 3GPP^TM Rel.14 NB-IoT standard, in four frequency bands (B1, B3, B5, and B8)
• Compact size (17.6 x 15.7 x 2.3 mm) meets dimensional requirements of most products
• Fulfills M2M requirements making it suitable for portable services, security systems, wireless POS devices, industrial quality PDAs, smart watches, total remote controls, etc.
• Wide range of physical interfaces, including 42-pin SMT, bidirectional serial connector (3-wire serial connector and one full-function serial connector), and UART

• Ultra-low package NB-IoT 3GPP^TM Rel.13 module with LCC form factor
• Optimized low power working mode with PSM and eDRX power saving features
• eSIM support for mobility and lower power consumption
• Support for multiple protocols including CoAP, TCP/UDP, MQTT, OMA-LwM2M, oneNET

• GNSS support
• Multi-mode LTE FDD & WCDMA &GSM
• Embedded TCP/UDP
• Embedded FTP/HTTP
• Supports 3GPP Rel. 10
• Pin-to-pin 30x30 LCC compatibility

• GNSS support
• Multi-mode LTE FDD & WCDMA &GSM
• Embedded TCP/UDP
• Embedded FTP/HTTP
• Supports 3GPP Rel. 10
• Pin-to-pin mPCI adapter standard compatibility

• Compact-sized NB-IoT module, with ultra-low power consumption and super-high sensitivity
• LCC package makes it easy for large volume manufacturing
• Compatible with GSM/GPRS module, easy for future upgrading
• Embedded with abundant Internet service protocols
• Fast time-to-market: Reference designs, evaluation tools and timely technical support minimize design-in time and development efforts

• Cost-effective, lower-power LTE/UMTS/GSM connectivity optimized for broadband IoT applications
• Designed for industrial-grade M2M applications such as vehicle telematics, tracking, mobile payment, industrial router, safety monitor, and industrial PDAs
• Enhanced features like FOTA, USSD, IPV6/IPV4, and Huawei enhanced AT commands
• Extended operating temperature: -40°C to +85°C

• Kinéis offers a unique combination of cost effective and miniaturized technology enabling customers to get visibility over their assets worldwide regardless of the application
• Module dedicated for global IoT connectivity
• Low power transmitter module optimized for battery powered solutions
• CE marking and fully certified by Kinéis and CNES (French Space Agency)
• Kinéis enhanced AT commands on UART interface

• Based on the 3GPP^TM-compliant HiSilicon BoudicaV120 chipset platform
• Compact size for ultra-low power consumption
• Support for deep indoor coverage
• Jamming protection implemented

• Ultra-small size NB-IoT module, 20 x 16 x 2.2 mm³
• Supports 3GPP^TM Rel.14 NB-IoT air interfaces and protocols
• Ultra-low power consumption
• Up to +20 dB extended coverage compared to GPRS (164 dB MCL)
• Operating Temp Range of -30°C to 85°C
• CoAP over UDP/IP
• GSMA TS.34 communication efficiency enhancements (Radio Policy Manager)

• Support NB-IoT/LTE-M/EGPRS modes
• Support Rel.14 LTE Cat.M1 & NB2
• LCC package with ultra-compact size
• Extremely low power consumption
• Industrial-level temperature range
• Embedded Internet service protocols
• Fast time to market; reference designs and timely technical support to accelerate the customer’s development
• Basic functions to suit M2M wide range of applications

• Support LTE Cat.1 with a maximum Downlink rate of 10 Mbps
• Support full coverage of GSM/GPRS/LTE Cat.1 network system
• Support FOTA remote upgrade

• LCC package, with stable and reliable performance
• Supports low/mid/high bands
• Small size and very convenient for SMT
• Meet the needs of customers for small module products and can be widely used for various products and equipment of IoT

• LTE Category: NB-IoT Rel.13,14
• Chipset: HiSilicon Hi2115
• Interface: UART/I2C/ADC/GPIOs
• Built-in ARM^® Cortex^® M0 core with 64KB SRAM & 256KB flash
• Operating Temp: -30°C to +85°C

• Small form factor (11.1 mm x 11.4 mm x 1.4 mm)
• Power consumption enables up to 10 year battery life hibernation
• OTA firmware upgrade
• OMA Lightweight M2M (LwM2M)
• Control via AT commands according to 3GPP^TM TS27.005, 27.007, and customized AT commands
• Carrier certifications: PTCRB (5.38), GCF (3.73)

• Small form-factor (11.1 x 11.4 x 1.4 mm)
• Power consumption enables up to 10-year battery life hibernation
• OTA firmware upgrades supported
• OMA Lightweight M2M (LwM2M)
• Control via AT commands according to 3GPP^TM TS27.005, TS27.007, and customized AT commands
• Carrier Certifications: PTCRB (5.38), GCF (3.73)

• LTE Category: NB-IoT Rel.13,14
• Chipset: Mediatek MT2625
• Interface: UART/SPI/GPIO
• Built-in ARM^® Cortex^® M4 156MHz core with 4MB SRAM & 4MB flash
• Operating Temp: -40°C to +85°C

• Certified as a modem for ease of integration with several different types of applications
• Ultra small form factor, only 13.2 mm x 10.6 mm x 1.8 mm
• Low power consumption (3.3μA in PSM) enables up to 10 years of battery life
• Ideal for water and gas meters, industrial IoT and asset tracking

• High-performance, ultra-low power consumption NB-IoT / Cat.M1 / EDGE module
• LCC package with compact size perfectly suited for applications with strict size requirement
• Supports GNSS and various hardware interfaces for easy development
• Well applicable to IoT communications devices requiring low speed and low power consumption
• Neoway enhanced AT commands

• The world's smallest NB-IoT module in LGA package, perfect for applications with strict size requirements
• High-performance, ultra-low power consumption
• Compliant to 3GPP^TM Release 13, software upgradable to Release 14
• Embedding Neoway Extended AT commands
• Supporting Enhanced PSM function for fast data recovery
• Supporting FOTA upgrade for remote firmware update
• Optimal for IoT devices that requires a low speed and low power consumption

• LTE Cat.M1/Cat.NB2/EGPRS module with ultra-low power consumption
• Integrated RAM and flash in baseband chipset
• Supports global frequency bands by one BOM
• Rich interfaces, high reliability
• Professional reference design, evaluation kits and timely technical support to help customers quickly complete product development

• Features an ARM Cortex-A5 processor with a clock frequency of 500 MHz, and a 32 KB I-cache and a 32 KB D-cache,
• Supports the LTE Cat.1bis network standard, with a maximum downlink speed of 10 Mbps and a maximum uplink speed of 5 Mbps,
• Supports GNSS, WiFi scan, PCM,USIM, UART, I2C, I2S, USB2.0, SPI, ADC,
• The N706-EA module is compatible with the N706-CB and N701-CA modules in terms of packaging.

• 5G/4G/3G multi-mode module with M.2 form factor, optimized for IoT and eMBB applications
• Both 5G modes: NSA and SA are supported
• Internet-friendly with integrated TCP/IP and UDP/IP stacks
• Worldwide 5G and LTE-A coverage
• Downlink/Uplink MIMO (4x4/2x2), ENDC/LTE carrier aggregations
• Feature refinements: DFOTA and VoLTE (optional)

• LTE-A Cat 6 module with M.2 form factor
• Support DL 2 Carrier Aggregation and 64QAM
• Worldwide LTE-A and UMTS/ HSPA+ coverage
• Built-in eSIM (optional), DSSA
• Low power mode
• Multi-constellation GNSS receiver available for applications requiring fast and accurate fixes in any environment
• MIMO technology meets demands for data rate and link reliability in modem wireless communication systems

• LTE-A Cat 6 module with M.2 form factor
• Support DL 2 Carrier Aggregation and 64QAM
• Worldwide LTE-A and UMTS/ HSPA+ coverage
• Built-in eSIM (optional), DSSA
• Low power mode
• Multi-constellation GNSS receiver available for applications requiring fast and accurate fixes in any environment
• MIMO technology meets demands for data rate and link reliability in modem wireless communication systems

• LTE-A Cat 16 module with M.2 form factor
• Support DL 5 Carrier Aggregation and 256QAM
• Worldwide LTE-A and UMTS/ HSPA+ coverage
• Support PCIe Gen2 interface for PC/Laptop application
• Built-in eSIM (optional), DSSA
• Low power mode
• Multi-constellation GNSS receiver available for applications requiring fast and accurate fixes in any environment
• MIMO technology meets demands for data rate and link reliability in modem wireless communication systems

• Multimode NB-IoT and Cat-M1 with GPS
• Dedicated application domain with ARM Cortex-M33 CPU, 1MB of memory and rich peripheral set
• Open Source Software Development Kit (SDK) shared with Nordic’s nRF5 Bluetooth products
• Global LTE band support
• Ultra-Low Power design for cellular IoT applications
• Extended temperature range of -40°C to +85°C

• Multimode LTE-M/NB-IoT modem with DECT NR+ support and GNSS 
• High integration (NB/M1 baseband, module, application CPU (Cortex-M33), RAM+Flash, GPS) and small size 
• 700-2200 MHz LTE band support 
• Fully integrated SiP for cellular IoT and DECT NR+ 
• Security (ARM TrustZone, Key Management Unit, ARM CryptoCell 310) 
• Support for Non-Terrestrial Network (NTN) in a future firmware release 

• Rich resources with motor driver and eSIM inside
• Support for 24 bit differential ADC
• Customized device management platform
• Suitable for water/gas meters, smart smoke detectors, smart home, smart city applications

• Rich resources with motor driver
• Support for 10 bit single ADC
• Customized device management platform
• Suitable for water/gas meters, smart smoke detectors, smart home, smart city applications

• Rich resources with motor driver and eSIM inside
• Support for 24 bit differential ADC and rich GPIO
• Customized device management platform
• Suitable for water/gas meters, smart smoke detectors, smart home, smart city applications

• 3G / LTE / 5G M.2 module based on the Qualcomm SDX72 chipset
• Both 5G modes: NSA and SA supported
• Supports a wide range of supported LTE/5G NR frequency bands commonly used in different regions of the world
• Downlink/Uplink MIMO (4x4 / 2x2), ENDC / NR / LTE carrier aggregations
• Multi-constellation GNSS receiver available for applications requiring fast and accurate fixes in any environment

• Integrated GNSS Supports GPS, Glonass, BeiDou, Galileo
• Integrated Cortex A7 processor, Supports ThreadX and AliOS Things RTOS
• Hardened Security, Secure boot/debug, storage, key provsioning, Trusted Execution Environment
• One hardware design supporting: eMTC/Cat-M1, NB-IoT/Cat-NB2, E-GPRS
• One software: Image no matter what technology is used
• One RF: Extended frequency range support
• from 450MHz to 2.1GHz supporting >23 global bands

• Gobal multi-mode connectivity solution for IoT, supporting 15 LTE spectrum bands
• One hardware design, supporting the high reliability, low latency, and voice support of LTE Cat.M1 (eMTC) with the extended coverage and delay tolerance of Cat.NB1 (NB-IoT), together with E-GPRS
• Integrated GNSS (GPS, GLONASS, BeiDou/Compass, Galileo, QZSS)
• Single SKU allowing device manufacturers to support ultra-low power consumption and cost-optimized solutions of carriers/end-users worldwide
• Futureproof with OTA upgrade

• Global single-mode Rel.14 NB2 (NB-IoT) enabling extended coverage for delay tolerant applications
• Ultra-low power with sub 1µA sleep current
• Integrated RF transceiver and RF front end enabling RF frequency bands from 700MHz to 2.1GHz
• Integrated ARM Cortex M3 application processor
• Single chip solution includes modem baseband, memory, RF transceiver with fully integrated RF front end, and power management units enabling sub 100sq mm modules
• Comprehensive set of IoT networking protocols

• Global LTE Cat 1bis with a Wi-Fi receiver for indoor positioning
• Ultra-low power with sub 2µA sleep current
• Integrated LTE modem and RF transceiver and RF front end enabling RF frequency bands from 700MHz to 2.6GHz
• Integrated dual core ARM Cortex M3 application processor
• Support for external RF front end like Qualcomm QPA8675 multiband PA
• Support for indoor position location with 2.4 GHz Wi-Fi Scanning capability using a shared RX with LTE
• Comprehensive set of IoT networking protocols

• LTE IOT modem with GSMA approved and highly secure integrated SIM or iSIM that obviates the need for eSIM/SIM to reduce TCO
• Ultra low power: ~1.5 uA in PSM and < 10 uA in eDRX mode
• Qualified for industrial use cases as the silicon support junction temperature of 105C
• Global RF band support: 600 MHz to 2.7 GHz
• Extremely secure due to support for secure boot, secure storage, hardware based cryptography
• In-built support for WiFi and cellular based positioning and support precise GNSS positioning using external GNSS receiver

• Power saving design ensures ultra-low power consumption
• Specialized PSM_EINT for easy module wake-up via external interrupt
• Built-in eSIM reserved
• Multi-band and rich external interfaces ensuring convenient application
• Compatible with Quectel GSM/GPRS M66, NB-IoT BC66, BC66-NA and BC68 modules, easy for future upgrading and migration
• Embedded with abundant Internet service protocols

• Compact NB-IoT module with ultra-low power consumption
• Low power supply voltage: 2.1V~3.63V
• Support high speed movement (80~120km/h)
• OpenCPU solution minimizes application design
• Specialized PSM_ENIT for easy module wake-up via external interrupt
• Build-in eSIM reserved
• Multi-band and rich external interfaces ensure convenient application
• Compatible with Quectel GSM/GPRS module, easy for future upgrading
• Embedded with abundant Internet service protocols

• Compact, 3GPP^TM Rel. 14 NB2 LPWA module with ultra-low power consumption
• Support for radio frequency bands B1, B2, B3, B4, B5, B8, B12, B13, B17, B18, B19, B20, B25, B28, B66, B71, B85
• Low power supply voltage: 2.1 - 3.63 V
• QuecOpen® solution minimizes application design
• Specialized PSM_EINT for easy module wake-up via external interrupt
• Built-in eSIM reserved
• Multi-band and rich external interfaces ensure convenient application
• Compatible with Quectel GSM/GPRS module, easy for future upgrading
• Embedded with abundant Internet service protocols

• Compact-sized multi-band NB-IoT module
• Ultra-low power consumption
• Super high sensitivity
• LCC package makes it easy for large volume manufacturing
• Compatible with Quectel GSM / GPRS module, easy for future upgrading
• Embedded with abundant Internet service protocols
• Fast time-to-market: Reference designs, evaluation tools and timely technical support minimize design-in time and development efforts

• Compact-sized multi-band NB-IoT module
• Ultra-low power consumption
• Super high sensitivity
• Low voltage power supply: 2.1 - 4.2 V
• Integrated BLE 5.0
• Compatible with Quectel GSM / GPRS module, easy for future upgrading
• Embedded with abundant Internet service protocols
• Fast time-to-market: Reference designs, evaluation tools and timely technical support minimize design-in time and development efforts

• NB-IoT/GSM dual-mode module with ultra-low power consumption, compact size and high sensitivity
• Multi-band and rich external interfaces ensuring convenient application
• Compatible with Quectel GSM/GPRS M95 module, NB-IoT BC95-G module and LPWA BG95 module, easy for future upgrading
• Embedded with abundant Internet service protocols

• High-performance NB-IoT module with ultra-low power consumption
• Compact-sized LCC package makes it easy for large volume manufacturing
• Compatible with Quectel GSM / GPRS module, easy for future upgrading
• Multiple serial ports
• Embedded with abundant Internet service protocol
• Quectel enhanced AT commands
• Extended temperature range: -40°C to +85°C

• High-performance NB-IoT module with ultra-low power consumption
• Compact-sized LCC package makes it easy for large volume manufacturing
• Compatible with Quectel GSM / GPRS module, easy for future upgrading
• Multiple serial ports
• Embedded with abundant Internet service protocols
• Quectel enhanced AT commands
• Extended temperature range: -40°C to +85°C

• Compact-sized multi-band NB-IoT module
• Ultra-low power consumption
• Super high sensitivity
• LCC package makes it easy for large volume manufacturing
• Compatible with Quectel GSM / GPRS module, easy for future upgrading
• Embedded with abundant Internet service protocols
• Fast time-to-market: Reference designs, evaluation tools and timely technical support minimize design-in time and development efforts

• Compact-sized multi-band NB-IoT module
• Ultra-low power consumption
• Super high sensitivity
• Low voltage power supply: 2.1 - 4.2 V
• Integrated BLE 5.0
• Compatible with Quectel GSM/GPRS module, easy for future upgrading
• Embedded with abundant Internet service protocols
• Fast time-to-market: Reference designs, evaluation tools and timely technical support minimize design-in time and development efforts

• High-performance LTE Cat.NB2 module supporting multiple frequency bands
• Ultra-low cost and power consumption
• Built-in eSIM reserved
• Wide power supply range: 2.2–4.3 V
• Compatible with Quectel GSM/GPRS M66 and NB-IoT BC66 modules for easy upgrades
• Embedded with abundant Internet service protocols
• Multi-band and rich external interfaces ensuring convenient application
• LCC package facilitating large-volume manufacturing

• LTE Cat.M1/Cat.NB2 module with ultra-low power consumption
• Compact SMT form factor ideal for size-constrained applications with tight space
• Comprehensive set of hardware-based security features
• Super slim profile in LGA package
• Integrated RAM and Flash in the baseband chipset
• Fast time-to-market: reference designs, evaluation tools, and timely technical support minimize design-in time and development efforts
• Robust mounting and interfaces

• LTE Cat.M1 module with ultra-low power consumption
• Compact SMT form factor ideal for size-constrained applications with tight space
• Easy migration from Quectel GSM/GPRS, UMTS/HSPA and LTE modules
• Super slim profile in LGA package
• Integrated RAM and Flash in the baseband chipset
• Fast time-to-market: reference designs, evaluation tools, and timely technical support minimize design-in time and development efforts
• Robust mounting and interfaces
• Power Class 5 (21 dBm) maximum output power

• LTE Cat.M1/Cat.NB2 module with ultra-low power consumption
• Compact SMT form factor ideal for size-constrained applications with tight space
• Easy migration from Quectel GSM/GPRS, UMTS/HSPA, and LTE modules
• Super slim profile in LGA package
• Integrated RAM and Flash in the baseband chipset
• Fast time-to-market: reference designs, evaluation tools, and timely technical support minimize design-in time and development efforts
• Robust mounting and interfaces
• Power Class 5 (21 dBm) maximum output power

• LTE Cat.M1/Cat.NB2/EGPRS module with ultra-low power consumption
• Compact SMT form factor ideal for size-constrained applications with tight space
• Easy migration from Quectel GSM/GPRS, UMTS/HSPA and LTE modules
• Super slim profile in LGA package
• Integrated RAM and Flash in the baseband chipset
• Fast time-to-market: reference designs, evaluation tools, and timely technical support minimize design-in time and development efforts
• Robust mounting and interfaces
• Power Class 5 (21 dBm) maximum output power

• Multi-band LTE Cat.M1/Cat.NB2/EGPRS module with global coverage
• Standard PCI Express® Mini Card form factor (Mini PCIe) ideal for manufacturers to easily integrate wireless connectivity into their devices
• Easy migration from Quectel LTE Standard Mini PCIe modules
• Multi-constellation GNSS receiver available for applications requiring fast and accurate fixes in any environment
• Fast time-to-market: reference designs, evaluation tools and timely technical support minimize design-in time and development efforts
• Robust mounting and interfaces

• LTE Cat.M1/Cat.NB2 module with ultra-low power consumption
• Compact SMT form factor ideal for size-constrained applications with tight space
• Easy migration from Quectel GSM/GPRS, UMTS/HSPA, and LTE modules
• Super slim profile in LGA package
• Integrated RAM and Flash in the baseband chipset
• Fast time-to-market: reference designs, evaluation tools, and timely technical support minimize design-in time and development efforts
• Robust mounting and interfaces
• Power Class 3 (23 dBm) maximum output power in LTE bands B31/B72/B73
• Power Class 5 (21 dBm) maximum output power in remaining LTE bands

• LTE Cat .M1/Cat.NB2/EGPRS module with ultra-low power consumption
• Compact SMT form factor ideal for size-constrained applications with tight space
• Easy migration from Quectel GSM/GPRS, UMTS/HSPA and LTE modules
• Super slim profile in LGA package
• Integrated RAM and Flash in the baseband chipset
• Fast time-to-market: reference designs, evaluation tools, and timely technical support minimize design-in time and development efforts
• Robust mounting and interfaces
• Power Class 3 (23 dBm) maximum output power

• LTE Cat.M1/Cat.NB2/EGPRS module with ultra-low power consumption
• Compact SMT form factor ideal for size-constrained applications with tight space
• Easy migration from Quectel GSM/GPRS, UMTS/HSPA and LTE modules
• Super slim profile in LGA package
• Integrated RAM and Flash in the baseband chipset
• Fast time-to-market: reference designs, evaluation tools, and timely technical support minimize design-in time and development efforts
• Robust mounting and interfaces
• Power Class 3 (23 dBm) maximum output power

• LTE Cat.M1/Cat.NB2/EGPRS module with ultra-low power consumption
• Easy migration from Quectel GSM/GPRS, UMTS/HSPA, and LTE modules
• Integrated RAM and flash in the baseband chipset
• Comprehensive set of hardware-based security features
• Support CS voice* for GSM, QuecOpen®, eSIM, etc.
• Fast time-to-market: reference designs, evaluation tools, and timely technical support minimize design-in time and development efforts
• Compact SMT form factor ideal for size-constrained applications with tight space

• LTE Cat.M1/Cat.NB1/EGPRS multimode module with ultra-low power consumption
• Pin-to-pin compatibility for easy migration from Quectel LTE, Cat.NB1, UMTS/HSPA, GSM/GPRS modules
• Compact SMT form factor (26.5mm × 22.5mm × 2.3mm) ideal for size-constrained applications
• Slim profile in LGA package allows fully automated manufacturing for high-volume applications
• Robust mounting and industry-standard interfaces: USB, UART, I2C, Status Indicator
• Fast time-to-market: Reference designs, evaluation tools, timely technical support

• LTE Cat-M1/Cat-NB2/EGPRS module with ultra-low power consumption
• Easy migration from Quectel GSM/GPRS/GNSS module MC60
• Integrated RAM and flash in the baseband chipset
• Comprehensive set of hardware-based security features
• Fast time-to-market: reference designs, evaluation tools and timely technical support minimize design-in time and development efforts
• Compact SMT form factor ideal for size-constrained applications with tight space
• Robust mounting and interfaces

• Extremely compact LTE Cat.M1/NB1/NB2 module with ultra-low power consumption
• Integrated RAM and flash
• Super slim profile in LGA package
• Embedded with abundant Internet service protocols
• Supports QuecLocator®, and DFOTA
• A rich set of external, multi-band interfaces that ensure convenient applications
• Fast time-to-market: reference designs, evaluation tools and timely technical support minimize time and efforts in design and development
• Robust mounting and interfaces

• Extremely compact LTE Cat.M1/NB1/NB2 module with ultra-low power consumption
• Integrated RAM and flash
• Super slim profile in LGA package
• Embedded with abundant Internet service protocols
• Supports QuecLocator® and DFOTA
• A rich set of external, multi-band interfaces that ensure convenient applications
• Fast time-to-market: reference designs, evaluation tools and timely technical support minimize time and efforts in design and development
• Robust mounting and interfaces

• Extremely compact LTE Cat-M1/NB1/ NB2 module with ultra-low power consumption
• Integrated RAM and flash
• Super slim profile in the LGA package
• GPS, GLONASS support
• Embedded with abundant Internet service protocols
• Support for QuecLocator®, and DFOTA
• Fast time-to-market: Reference designs, evaluation tools and timely technical support minimize time and efforts in design and development

• Extremely compact LTE Cat-M1/NB1/ NB2 module with ultra-low power consumption
• Integrated RAM and flash
• Super slim profile in the LGA package
• Supports GPS, GLONASS, BeiDou, Gallileo, QZSS
• Embedded with abundant Internet service protocols
• Support for QuecLocator®, and DFOTA
• Fast time-to-market: Reference designs, evaluation tools and timely technical support minimize time and efforts in design and development

• Cost-effective, lower-power LTE connectivity optimized for broadband IoT applications, worldwide LTE, UMTS/HSPA+, and GSM/GPRS/EDGE coverage
• Multi-constellation GNSS receiver available for applications requiring fast and accurate fixes in any environment
• Feature refinements: supports DFOTA, eCall, and DTMF MIMO technology meets demands for data rate and link reliability in modem wireless communication systems
• VoLTE support
• Voice call and SMS (Text/PDU format) support
• 3GPP^TM Release 10 compliant

• Cost-effective, lower-power LTE connectivity optimized for broadband IoT applications, worldwide LTE, UMTS/HSPA+, and GSM/GPRS/EDGE coverage
• Multi-constellation GNSS receiver available for applications requiring fast and accurate fixes in any environment
• Feature refinements: supports DFOTA, eCall, and DTMF MIMO technology meets demands for data rate and link reliability in modem wireless communication systems
• VoLTE support
• Voice call and SMS (Text/PDU format) support
• 3GPP^TM Release 10 compliant

• Cost-effective, lower-power LTE connectivity optimized for broadband IoT applications
• Worldwide LTE, UMTS/HSPA+, and GSM/GPRS/EDGE coverage
• Feature refinements: supports DFOTA, eCall, QuecLocator, and DTMF
• MIMO technology meets demands for data rate and link reliability in modem wireless communication systems

• Cost-effective, lower-power LTE connectivity optimized for broadband IoT applications
• Worldwide LTE, UMTS/HSPA+, and GSM/GPRS/EDGE coverage
• Feature refinements: supports DFOTA, eCall, QuecLocator, and DTMF
• MIMO technology meets demands for data rate and link reliability in modem wireless communication systems
• Pin-to-pin compatibility thanks to Mini-PCIe port

• Cost-effective, lower-power LTE connectivity optimized for broadband IoT applications
• Worldwide LTE, UMTS/HSPA+, and GSM/GPRS/EDGE coverage
• Feature refinements: supports DFOTA, eCall, QuecLocator, and DTMF
• MIMO technology meets demands for data rate and link reliability in modem wireless communication systems

• Cost-effective, lower-power LTE connectivity optimized for broadband IoT applications
• Worldwide LTE, UMTS/HSPA+, and GSM/GPRS/EDGE coverage
• Feature refinements: supports DFOTA, eCall, QuecLocator, and DTMF
• MIMO technology meets demands for data rate and link reliability in modem wireless communication systems
• Pin-to-pin compatibility thanks to Mini-PCIe port

• Worldwide LTE, UMTS/HSPA+, and GSM/GPRS/EDGE coverage
• IPv6 support
• Updating firmware over the air (DFOTA)
• GNSS supported (GPS, GLONASS, BeiDou, Galileo, and QZSS)
• Extended temperature range of -40°C to +85°C
• VoLTE support (optional)
• Voice call and SMS (Text/PDU format) support
• Compact design (32.0mm × 29.0mm × 2.4mm)

• Worldwide LTE, UMTS/HSPA+, and GSM/GPRS/EDGE coverage
• IPv6 support
• Updating firmware over the air (DFOTA)
• GNSS supported (GPS, GLONASS, BeiDou, Galileo, and QZSS)
• Extended temperature range of -40°C to +85°C
• VoLTE support (optional)
• Voice call and SMS (Text/PDU format) support
• Compact design (32.0mm × 29.0mm × 2.4mm)
• Pin-to-pin compatibility thanks to Mini-PCIe port

• Cost-effective, lower-power LTE connectivity optimized for broadband IoT applications in LGA package
• LTE Cat.4 module optimized for M2M and IoT applications
• Worldwide LTE, UMTS/HSPA+, and GSM/GPRS/EDGE coverage
• Multi-constellation GNSS receiver available for applications requiring fast and accurate fixes in any environment
• Feature refinements: supports DFOTA, eCall, and DTMF
• MIMO technology meets demands for data rate and link reliability in modem wireless communication systems

• Cost-effective, lower-power LTE connectivity-optimized for broadband IoT applications in Mini-PCIe variant
• LTE Cat.4 module optimized for M2M and IoT applications
• Worldwide LTE, UMTS/HSPA+, and GSM/GPRS/EDGE coverage
• Multi-constellation GNSS receiver available for applications requiring fast and accurate fixes in any environment
• Feature refinements: supports DFOTA, eCall, and DTMF
• MIMO technology meets demands for data rate and link reliability in modem wireless communication systems

• Cost-effective, lower-power LTE connectivity optimized for broadband IoT applications
• Worldwide LTE, UMTS/HSPA+, and GSM/GPRS/EDGE coverage
• Feature refinements: supports DFOTA, eCall, QuecLocator, and DTMF
• MIMO technology meets demands for data rate and link reliability in modem wireless communication systems

• Cost-effective, lower-power LTE connectivity optimized for broadband IoT applications
• Worldwide LTE, UMTS/HSPA+, and GSM/GPRS/EDGE coverage
• Feature refinements: supports DFOTA, eCall, QuecLocator, and DTMF
• MIMO technology meets demands for data rate and link reliability in modem wireless communication systems

• Cost-effective, lower-power LTE connectivity optimized for broadband IoT applications
• LTE Cat 4 module optimized for M2M and IoT applications
• Worldwide LTE, UMTS/HSPA+ and GSM/GPRS/EDGE coverage
• Multi-constellation GNSS receiver available for applications requiring fast and accurate fixes in any environment
• Feature refinements: Supports DFOTA, eCall, QuecLocator and DTMF
• MIMO technology meets demands for data rate and link reliability in modem wireless communication systems

• Cost-effective, lower-power LTE connectivity optimized for broadband IoT applications in universal interface: mini-PCIe package
• Worldwide LTE, UMTS/HSPA+, and GSM/GPRS/EDGE coverage
• Feature refinements: Supports DFOTA, eCall, QuecLocator, and DTMF
• MIMO technology meets demands for data rate and link reliability in modem wireless communication systems

• LTE Advanced Cat.6 module with LGA form factor, optimized for M2M and IoT applications
• Multi-constellation GNSS receiver available for applications requiring fast and accurate fixes in any environment
• Supports LTE Advanced carrier aggregation
• Worldwide LTE and UMTS/HSPA+ coverage
• Feature refinements: supports DFOTA and DTMF
• MIMO technology meets demands for data rate and link reliability in modem wireless communication systems

• LTE-A Cat 6 module with LGA form factor, optimized for M2M and IoT applications
• Supports LTE-A carrier aggregation
• MIMO technology meets demands on data rate and link reliability in modem wireless communication systems
• Power saving design ensures ultra-low power consumption
• Compact size
• Feature refinement supports DFOTA

• Worldwide LTE, UMTS/HSPA+, and GSM/GPRS/EDGE coverage
• IPv6 support
• Updating firmware over the air (DFOTA)
• Extended temperature range of -40°C to +85°C
• Optional GNSS support
• Optional VoLTE support
• Voice call and SMS (Text/PDU format) support
• Compact design (32.0mm × 29.0mm × 2.4mm)

• Worldwide LTE, UMTS/HSPA+, and GSM/GPRS/EDGE coverage
• IPv6 support
• Updating firmware over the air (DFOTA)
• Optional GNSS support (GPS, GLONASS, BeiDou, Galileo, and QZSS)
• Extended temperature range of -40°C to +85°C
• VoLTE support (optional)
• Voice call and SMS (Text/PDU format) support
• Compact design (32.0mm × 29.0mm × 2.4mm)
• Pin-to-pin compatibility thanks to Mini-PCIe port

• Cost-effective, lower-power LTE connectivity optimized for broadband IoT applications in LGA package
• LTE Cat 4 module optimized for M2M and IoT applications
• Worldwide LTE, UMTS/HSPA+, and GSM/GPRS/EDGE coverage
• Multi-constellation GNSS receiver available for applications requiring fast and accurate fixes in any environment
• Feature refinements: supports DFOTA, eCall, QuecLocator, and DTMF
• MIMO technology meets demands for data rate and link reliability in modem wireless communication systems

• Cost-effective, lower-power LTE connectivity optimized for broadband IoT applications in Mini-PCIe variant
• LTE Cat.4 module optimized for M2M and IoT applications
• Worldwide LTE, UMTS/HSPA+, and GSM/GPRS/EDGE coverage
• Multi-constellation GNSS receiver available for applications requiring fast and accurate fixes in any environment
• Feature refinements: supports DFOTA, eCall, QuecLocator, and DTMF
• MIMO technology meets demands for data rate and link reliability in modem wireless communication systems

• LTE Cat 1 module optimized for M2M and IoT applications
• LTE FDD coverage
• Support DFOTA
• Super cost-effective
• LTE module in compact size
• Support Wi-Fi Scan

• Cost-effective, lower-power LTE connectivity optimized for broadband IoT applications
• Multi-band LTE, UMTS/HSPA+, and GSM/GPRS/EDGE coverage
• Compact SMT form factor ideal for size-constrained applications with extended operation temperature range
• Embedded power management unit (PMU) featuring ultra-low deep-sleep current consumption
• Simple migration from 2G/3G to 4G with a flexible and scalable platform
• VoLTE support
• Voice call and SMS (Text/PDU format) support

• Cost-effective, lower-power LTE connectivity optimized for broadband IoT applications
• LTE Cat.1 module optimized for M2M and IoT applications
• Worldwide LTE, UMTS/HSPA+, and GSM/GPRS/EDGE coverage
• Embedded power management unit (PMU) featuring ultra-low deep-sleep current consumption
• Feature refinements: supports DFOTA, QuecLocator and DTMF
• Compact SMT form factor ideal for size-constrained applications with extended operation temperature range
• Simple migration from 2G/3G to 4G with a flexible and scalable platform

• LTE Cat 1 module optimized for M2M and IoT applications
• Worldwide LTE, GSM/GPRS coverage
• Abundant functional interfaces
• Support analog audio
• Bluetooth (Optional)
• Wi-Fi Scan (Optional)
• Supports FOTA
• Super cost-effective

• LTE Cat 4 module optimized for M2M and IoT applications
• Multi-band LTE, UMTS/HSPA(+) and GSM/GPRS/EDGE coverage
• Compact SMT form factor ideal for size-constrained applications with extended operation temperature range
• Embedded power management unit (PMU) featuring ultra-low deep-sleep current consumption
• Simple migration from 2G/3G to 4G with a flexible and scalable platform

• LTE Cat 4 module optimized for M2M and IoT applications
• Multi-band LTE, UMTS/HSPA(+) and GSM/GPRS/EDGE coverage
• Compact SMT form factor ideal for size-constrained applications with extended operation temperature range
• Embedded power management unit (PMU) featuring ultra-low deep-sleep current consumption
• Simple migration from 2G/3G to 4G with a flexible and scalable platform

• LTE-Advanced Cat.6 module with M.2 form factor, optimized for M2M and IoT applications
• Multi-constellation GNSS receiver available for applications requiring fast and accurate fixes in any environment Supports
• LTE-Advanced carrier aggregation
• Worldwide LTE and UMTS/HSPA+ coverage
• Feature refinements: supports DFOTA and DTMF
• MIMO technology meets demands for data rate and link reliability in modem wireless communication systems

• LTE-A Cat 6 module with M.2 form factor
• Support DL 2 Carrier Aggregation and 64QAM
• Worldwide LTE-A and UMTS/ HSPA+ coverage
• Built-in eSIM (optional), DSSA
• Low power mode
• Multi-constellation GNSS receiver available for applications requiring fast and accurate fixes in any environment
• MIMO technology meets demands for data rate and link reliability in modem wireless communication systems

• LTE-A Cat 6 module with M.2 form factor
• Support DL 2 Carrier Aggregation and 64QAM
• Worldwide LTE-A and UMTS/ HSPA+ coverage
• Built-in eSIM (optional), DSSA
• Low power mode
• Multi-constellation GNSS receiver available for applications requiring fast and accurate fixes in any environment
• MIMO technology meets demands for data rate and link reliability in modem wireless communication systems

• LTE-A Cat.12 module with M.2 form factor, optimized for M2M and IoT applications
• Support DL 3x carrier aggregation and 256QAM
• Worldwide LTE-A and UMTS/HSPA(+) coverage
• Multi-constellation GNSS receiver available for applications requiring fast and accurate fixes in any environment
• Feature refinements: supports DFOTA and DTMF
• MIMO technology meets demands for data rate and link reliability in modem wireless communication systems
• Adopting the 3GPP Rel. 12 LTE technology, it delivers M2M-optimized speeds of 600Mbps downlink and 150Mbps uplink peak data rates

• LTE-A Cat 16 module with M.2 form factor
• Support DL 5 Carrier Aggregation and 256QAM
• Worldwide LTE-A and UMTS/ HSPA+ coverage
• Support PCIe Gen2 interface for PC/Laptop application
• Built-in eSIM (optional), DSSA
• Low power mode
• Multi-constellation GNSS receiver available for applications requiring fast and accurate fixes in any environment
• MIMO technology meets demands for data rate and link reliability in modem wireless communication systems

• LTE-Advanced Cat.6 module with Mini PCIe form factor, optimized for M2M and IoT applications
• Multi-constellation GNSS receiver available for applications requiring fast and accurate fixes in any environment
• Supports LTE-Advanced carrier aggregation
• Worldwide LTE and UMTS/HSPA+ coverage

• Low-cost device
• Low power comsumption
• BT 3.0 support
• Quad-band 850, 900, 1800, 1900 MHz
• Voice call and SMS (Text/PDU format) support
• 3GPP^TM Rel.4 compliant
• Extended temperature range of -40°C to +85°C

• Low power consumption
• Low cost device
• Extended temperature range of -40°C to +85°C
• Quad-band 850, 900, 1800, 1900 MHz
• BT 3.0 support
• Voice call and SMS (Text/PDU format) support

• Compact design at 19.9mm x 23.6mm
• Extended temperature range of -40°C to +85°C

• Low power consumption
• Low cost device
• BT 3.0 support
• Extended temperature range of -40°C to +85°C
• Quad band 850, 900, 1800, 1900 MHz
• Multi GNSS support (GPS, GLONASS, Galileo, QZSS)
• Supports 3GPP Rel.99/Rel.4
• Voice call and SMS (Text/PDU format) support

• Low power consumption
• Low cost device
• BT 4.0 support (BLE)
• Extended temperature range of -40°C to +85°C
• Quad band 850, 900, 1800, 1900 MHz
• Multi GNSS support (GPS, GLONASS, Gallileo, QZSS)
• Supports 3GPP Rel.4
• Voice call and SMS (Text/PDU format) support

• Optimized for IoT and M2M applications with LGA form factor supported
• Worldwide 5G/4G/3G coverage
• Supported 5G NSA and SA modes
• Feature refinements: DFOTA and VoLTE (Optional)

• 5G sub-6GHz module
• 52.0 mm × 30.0 mm × 2.3 mm, 8.4g
• M.2 form factor
• Max. downlink 2.5Gbps / 900Mbps uplink
• Extended temperature range of -40°C to +85°C

• 5G sub-6GHz module
• 52.0mm × 30.0mm × 2.3mm, 8.4g
• M.2 form factor
• Maximum Downlink 2.5Gbps / 900Mbps Uplink
• Extended temperature range of -40°C to +85°C

• 5G/4G/3G multi-mode module with M.2 form factor, optimized for IoT and eMBB applications
• Both NSA and SA modes supported
• Supports a wide range of supported LTE/5G NR frequency bands commonly used in many different regions of the world
• Downlink/Uplink MIMO (4x4 / 2x2), EN-DC / LTE carrier aggregations
• Multi-constellation GNSS receiver available for applications requiring fast and accurate fixes in any environment
• Backwards compatible module facilitates the migration and differentiation between 4G LTE and 5G

• 5G/4G/3G multimode module with M.2 form factor, optimized for IoT and eMBB applications
• Both NSA and SA modes supported
• Supports a wide range of supported LTE/5G NR frequency bands commonly used in many different regions of the world
• Downlink/Uplink MIMO (4x4 / 2x2), EN-DC/LTE carrier aggregations
• Multi-constellation GNSS receiver available for applications requiring fast and accurate fixes in any environment
• Backwards compatible module, to help facilitate the migration and differentiation between 4G LTE and 5G

• 5G/4G/3G multi-mode module with M.2 form factor, optimized for IoT and eMBB applications
• Both 5G modes: NSA and SA are supported
• Internet friendly with integrated TCP/IP and UDP/IP stacks
• Worldwide 5G and LTE-A coverage
• Downlink/Uplink MIMO (4x4/2x2), ENDC/LTE carrier aggregations
• Feature refinements: DFOTA and VoLTE (optional)

• Worldwide UMTS/HSDPA+ and GSM/GPRS/EDGE coverage
• GNSS receiver available for applications requiring fast and accurate fixes in any location
• High-quality data and image transmission even in harsh environment
• Robust mounting and interfaces
• Fast time-to-market: reference designs, evaluation tools and timely technical support minimize design-in time and development efforts

• Worldwide UMTS/HSPA+ and GSM/GPRS/EDGE coverage
• Standard Mini PCIe form factor maximizes the convenience for customers to design and use High-quality data and image transmission even in harsh environment
• High sensitivity GNSS receiver available for applications requiring fast and accurate fixes in any location
• Fast time-to-market: reference designs, evaluation tools and timely technical support minimize design-in time and development efforts
• Robust mounting and interfaces

• GSM/UMTS worldwide connectivity
• Penta band UMTS/HSPA
• Super slim profile in LGA package
• Compact SMT form factor for size-constrained applications
• Extended temperature range of -40°C to +85°C
• Voice call and SMS (Text/PDU format) support
• Supports 3GPP^TM Rel.7

• Ultra small 20 mm x 21 mm x 1.5 mm LGA form factor
• Worldwide band support in a Single SKU^TM design
• Lowest power consumption with 1 microAmp PSM
• eco-Paging^TM for optimized eDRX
• Power class options 20 dBm and 23 dBm
• On-modem location based services

• Small, M.2 form factor
• High speed data module, Cat6 LTE, DL 300Mbps UL 50Mbps
• Rx diversity for 3G/4G, MIMO: 2x2
• Low power and low cost
• Globally approval module

• M.2 form factor LTE Advanced category 12 wireless communication module based on Qualcomm SDX12 chipset
• Supports 3 modes of LTE-TDD/LTE-FDD/WCDMA
• The peak data rates can reach 600Mbps downlink and 150Mbps uplink
• Can cover Global mobile network and provide perfect high-speed experience for PC, Laptop and Tablets customers

• Small ,Slim M.2 form factor (30x52x2.3mm)
• High speed data module, 5G NR Sub6 peak DL 4.67Gbps UL 1.25Gbps; NSA peak DL 3.74Gbps UL 835Mbps; LTE peak DL 1.6Gbps UL 211Mbps
• Rx diversity for 3G/4G/5G, support global band, up to 4x4 DL-MIMO & 256QAM
• GNSS support (GPS, GLONASS, BeiDou, Galileo, QZSS)
• Low power and low cost

• RW350-GL-16 is an M.2 form factor LTE Advanced category 16 wireless communication module.
• It supports 3 modes of LTE-TDD/LTE-FDD/WCDMA.
• The peak data rates can reach 1Gbps downlink and 211Mbps uplink.
• IFM350-GL-16 can cover the Global mobile network and provide a perfect high-speed experience for PC, Laptop and Tablets customers.)

• Improved indoor coverage is provided. In the same frequency band, NB-IoT gains 20dB over the existing GSM network and covers an area that is 100 times larger.
• RG-NB6120 features ultra-low power consumption with a maximum current of less than 5uA in PSM mode.
• In the case of the same base station, NB-IoT can provide 50-100 times more access than existing wireless technologies.
• Compared with LoRa, NB-IoT does not need to be rebuilt, and the radio and antenna are basically multiplexed. Low speed, low power consumption, and low bandwidth also bring low cost advantages to NB-IoT chips and modules.
• The RG-NB6120 supports interfacing with the IoT management platform. Meet the information collection and monitoring needs of the terminal.

• Ultra small 20 mm x 21 mm x 1.5 mm LGA form factor
• World-wide band support in a Single SKU^TM design
• Lowest power consumption with 1 microAmp PSM
• eco-Paging^TM for optimized eDRX
• Power class options 20 dBm and 23 dBm
• On-modem location based services

• 3GPP^TM LTE Release 14/15 Cat.M1
• New tiny "S" LGA module form factor, with single-rail power supply supporting 2.2–5.5V
• Programmable RF filtering for global band support in a Single-SKU design (617 MHz to 2.2 GHz)
• Adaptive output power of +23dBm, +20dBm and +14dBm, for most efficient deep indoor penetration
• Fully tested and calibrated for easy integration into product hardware
• Fully software-compatible with first generation Monarch GM01Q (LTE-M), enabling ease of migration

• Ultra small 20 mm x 21 mm x 1.5 mm LGA form factor
• World-wide band support in a Single SKU^TM design
• Lowest power consumption with 1 microAmp PSM
• eco-Paging^TM for optimized eDRX
• Power class options 20 dBm and 23 dBm
• On-modem location based services

• 3GPP^TM LTE Release 14/15 Cat.M1
• New tiny "S" LGA form factor, with single-rail power supply supporting 2.2–5.5V
• Programmable RF filtering for global band support in a Single-SKU design (617 MHz to 2.2 GHz)
• Adaptive output power of +23dBm, +20dBm and +14dBm, for most efficient deep indoor penetration
• Fully tested and calibrated for easy integration into product hardware
• Fully software-compatible with first generation Monarch GM01Q (LTE-M), enabling ease of migration

• 20x24mm, LGA 94-pad
• Multiple Band (3, 5, 8, 20...)
• 3GPP^TM Release 13/Release 14
• UART, I2C, GPIO, USIM, ADC, Antenna
• PSM/DRX/eDRX
• IP/UDP/TCP/COAP/LWM2M
• DTLS/DTLS+
• Cell Reselect
• DNS over UDP
• HTTP over TCP
• Non-IP

• Extremely Compact Form-Factor
• Best-in-class Power Consumption according to vendor datasheet
• Open CPU & Rich Interface
• 3GPP^TM LTE-M and NB-IoT Dual-Mode Support
• One-for-All Design Supporting Multi-bands

• Extremely compact form factor 
• Best-in-class power consumption 
• Host mode with rich interface 
• Multiple protocol support 
• Foot print Compatible with SERCOMM other TPM54x series modules

Extremely Compact Form-Factor

Best-in-class Power Consumption according to vendor datasheet

Open CPU & Rich Interface

LTE-M and NB-IoT Dual-Mode Support

Embedded H/W GNSS, a-GPS & Cellular Positioning Technology (POLTE)

One-for-All Design Supporting Multi-bands

• 4G/3G multimode module with M.2 form factor
• Optimized for IoT and eMBB applications
• Embedded TCP/IP stack to easily communicate over the internet
• LTE carrier aggregations
• GNSS receiver enables tracking and location-based services

• Supports the latest 4G and 3G networks in North America, Europe, and Asia
• The PCI Express M.2 form factor allows easy integration into smaller and thinner devices
• Optimized for low power consumption
• Ideal for today’s mobile computing, networking, and industrial IoT applications
• Enhance network performance by aggregating licensed and unlicensed spectrum using LTE-LAA, and enable secure and stable private networks using CBRS band
• GNSS tracking lets you locate, monitor, and deploy location-based applications and services with module variants supporting GPS, GLONASS, Beidou, and Galileo satellite systems

• 5G/LTE Cat.20 M.2 data card module based on the SDX55 Qualcomm chipset
• Supports a wide range of supported LTE/5G NR frequency bands commonly used in many different regions of the world
• Downlink MIMO, ENDC/LTE carrier aggregations
• Integrated GNSS receiver (GPS, GLONASS, BeiDou, and Galileo satellite systems supported)
• Industrial grade - Tested for harsh environments and extreme temperatures
• Backwards compatible module, to help facilitate the migration and differentiation between 4G LTE and 5G

• 5G/LTE Cat.20 M.2 data card module based on the SDX55 Qualcomm chipset
• Supports a wide range of supported LTE/5G NR frequency bands commonly used in many different regions of the world
• Downlink MIMO, ENDC/LTE carrier aggregations
• Integrated GNSS receiver (GPS, GLONASS, BeiDou, and Galileo satellite systems supported)
• Industrial grade – Tested for harsh environments and extreme temperatures
• Backwards compatible module, to help facilitate the migration and differentiation between 4G LTE and 5G

• Common Flexible Form Factor (CF3) interchangeable among 2G, 3G, and 4G technologies
• Future-proof footprint
• Flexible solution in a compact and easy-to-integrate form factor
• Ready-to-use firmware upgrades
• GNSS interface support

• Compact: Smallest 4G/2G form factor on the market
• Future proof: Intelligent pin-to-pin compatibility
• Easy migration to LPWA
• Flexible: Solder down or snap-in socket options
• Tri-band LTE
• Voice call and SMS (Text/PDU format) support with fallback to 2G
• Supports 3GPP^TM Rel.9

• Very small form factor (15 mm x 18 mm x 2.4 mm)
• Global module compatible with all LTE-M & NB-IoT networks
• Best-in-class power consumption supporting PSM, eDRX, etc.
• Optimal 23dBm output power for extended coverage
• Integrated GNSS (GPS/GLONASS) receiver
• Secure Boot and embedded HTTPS and DTLS support
• Free firmware-over-the-air upgrades for future-proof deployments
• Integrated AirVantage® cloud services

• World’s smallest multi-mode LPWA module, offering best-in-class power performance for global LTE-M, NB-IoT, 2G, and GNSS networks
• Fully compliant with the 3GPP^TM Rel.13 standard and is Rel.14 ready to support NB2 features in the future
• Provides a new low-cost, best-in-class power technology for low-bandwidth IoT applications with extended reach beyond traditional cellular
• Delivers up to 300Kbps download speed and 375Kbps upload speed, this module is ideal for simple static sensor applications, or real-time fixed or mobile applications
• Fast time-to-market: Reference designs, evaluation tools, and timely technical support minimize design-in time and development efforts
• Robust mounting and interfaces

• Extremely small CF3® form factor (15x18x2.4 mm), compatible with other modules for easy design migration
• Worldwide frequency coverage on a single module with industry and mobile network certifications
• Ultra-Low power mode with smallest power consumption - 1.8uA in PSM and <30uA in eDRX, and RAI support
• Enhanced security with IoT keystore, integrated hardware secure elements and true random number generator
• Optional onboard iSIM and/or eSIM removes the need for an external SIM card
• Integrated GNSS Receiver for tracking and location-based services
• Faster speed with support for R14 Cat-M1 (590/1100kbps DL/UL) and R14 Cat-NB2 (125/158kbps DL/UL)
• Compliant with GSMA TS.34 IoT Device Network Efficiency Guidelines
• Integrated AirVantage® cloud services including Free firmware-over-the-air (FOTA) upgrades

Extremely small CF3® form factor (15x18x2.4 mm), compatible with other modules for easy design migration

Worldwide frequency coverage on a single module with industry and mobile network certifications

Ultra-Low power mode with smallest power consumption - 1.8uA in PSM and <30uA in eDRX, and RAI support

Enhanced security with IoT keystore, integrated hardware secure elements and true random number generator

Optional onboard iSIM and/or eSIM removes the need for an external SIM card

Integrated GNSS Receiver for tracking and location-based services

Faster speed with support for R14 Cat-M1 (590/1100kbps DL/UL) and R14 Cat-NB2 (125/158kbps DL/UL)

Compliant with GSMA TS.34 IoT Device Network Efficiency Guidelines

Integrated AirVantage® cloud services including Free firmware-over-the-air (FOTA) upgrades

• 3G HSPA Penta band module with fall back to 2G GSM/GPRS/EDGE Quad band
• Small form factor (22mm x 23mm) in SMD LGA package, for scalability between 2G, 3G and 4G with the same footprint and core pin layout
• Very low power consumption with separate baseband and PA power supply inputs for extended operational life in battery powered devices
• Integrated support for AirVantage management services, including ready-to-use lifetime firmware upgrades

• 3G HSPA Penta band module with fall back to 2G GSM/GPRS/EDGE Quad band
• Integrated GPS+Glonass receiver
• Small form factor (22mm x 23mm) in SMD LGA package, for scalability between 2G, 3G and 4G with the same footprint and core pin layout
• Very low power consumption with separate baseband and PA power supply inputs for extended operational life in battery powered devices
• Integrated support for AirVantage management services, including ready-to-use lifetime firmware upgrades

• 4G/3G multimode module with miniPCIe form factor
• Optimized for IoT and eMBB applications
• Embedded TCP/IP stack to easily communicate over the internet
• LTE carrier aggregations
• GNSS receiver enables tracking and location-based services

• Compact, lightweight, wireless LTE- and UMTS-based modem
• Ideal for portable and handheld computers, point-of-sale devices, telemetry products and other M2M applications

• Self-contained E-GSM/DCS/GSM850/PCS/GPRS/EGPRS 900/1800/850/1900 Quad band embedded module
• Supports Open AT Application Framework for embedded standard ANSI C applications to natively execute

• LTE Cat.4 module optimized for M2M and IoT applications
• Worldwide LTE, UMTS/HSPA+, and GSM/GPRS/EDGE coverage
• Embedded TCP/IP stack to easily communicate over the internet
• Flexible I/O Voltage
• VoLTE supported
• GNSS receiver enables tracking and location-based services

• LTE Cat.4 module optimized for M2M and IoT applications
• Worldwide LTE, UMTS/HSPA+, and GSM/GPRS/EDGE coverage
• Embedded TCP/IP stack to easily communicate over the internet
• Flexible I/O Voltage
• VoLTE supported
• GNSS receiver enables tracking and location-based services

• LTE Cat.4/3G/2G module with compact CF3® design to migrate between technologies and future-proof product designs
• Dedicated ARM core application processor running Legato® open source software
• mangOH® reference designs enable rapid prototyping and proof of concepts
• Industrial grade tested in harsh environments and exterme temperatures
• Voice call and SMS (Text/PDU format) support

• LTE Cat.1/3G/2G module with compact CF3® design to migrate between technologies and future-proof product designs
• Dedicated ARM core application processor running Legato® open source software
• mangOH® reference designs enable rapid prototyping and proof of concepts
• Industrial grade tested in harsh environments and exterme temperatures
• Voice call and SMS (Text/PDU format) support

• Implements Sierra Wireless CF3® form factor to allow migrating between technologies and future-proof product designs
• Dedicated ARM core application processor running Legato® open source software
• mangOH® reference designs enable rapid prototyping and proof of concepts
• Worldwide coverage on a single module with industry and mobile network certifications
• Ultra-Low Power Mode - Reduce power consumption by 200x for battery or solar powered applications
• Integrated GNSS receiver enables tracking and location-based services (optional)
• Tested for harsh environments and extreme temperatures (-40°C / +85°C)

• LTE Cat.1bis module optimized for M2M and IoT applications
• Worldwide LTE and GSM/GPRS/EDGE coverage
• Embedded TCP/IP stack to easily communicate over the Internet
• Flexible I/O Voltage
• VoLTE support
• Form factor is compatible with the SIM7600/SIM7600-H Series
• GNSS receiver enables tracking and location-based services (-FASE version)

• LCC+LGA form factor with abundant interfaces
• Suitable for LTE networks and integrated GNSS
• Abundant software functions: FOTA, SSL, LBS
• Compatible with the A7682E, A7683E series modules

• LTE Cat.1bis module optimized for M2M and IoT applications
• Worldwide LTE and GSM/GPRS/EDGE coverage
• Embedded TCP/IP stack to easily communicate over the Internet
• Flexible I/O Voltage
• VoLTE support
• Form factor is compatible with the SIM7000/SIM7070 Series
• GNSS receiver enables tracking and location-based services

• LTE Cat.1 bis module with MiniPCIe form factor
• Worldwide LTE and GSM/GPRS/EDGE coverage
• Embedded TCP/IP stack to easily communicate over the Internet
• Flexible I/O voltage
• VoLTE support
• Form factor is compatible with the SIM7000/SIM7070 Series
• GNSS receiver enables tracking and location-based services

• Compact size with abundant interfaces
• Abundant software functions: FOTA, SSL, LBS
• Form factor is compatible with the A7670/SIM7000/SIM7070 series and 2G SIM800F/SIM800

• LTE Cat.1bis module optimized for M2M and IoT applications
• Worldwide LTE and GSM/GPRS/EDGE coverage
• Embedded TCP/IP stack to easily communicate over the Internet
• Flexible I/O voltage
• VoLTE support
• GNSS receiver enables tracking and location-based services

• LCC+LGA form factor with abundant interfaces
• Suitable for LTE networks and integrated GNSS
• Abundant software functions: FOTA, SSL, LBS
• Compatible with the SIM800C, SIM868, SIM7080G and A7682E series modules

• Low cost device Extremely compact design at 17.6mm x 15.7mm x 2.3mm
• Extended temperature range of -40°C to +85°C
• Voice call and SMS support 43 pad SMT package

• Low power consumption
• Low cost device
• Extended temperature range of -40ºC to +85ºC
• Quad-band 850, 900, 1800, 1900 MHz
• Compact design with LCC / LGA pads
• GNSS support
• Voice call and SMS (Text/PDU format) support

• Low power consumption
• Low cost device
• Extended temperature range of -40°C to +85ºC
• Quad-band 850, 900, 1800, 1900 MHz
• Compact design with LCC / LGA pads
• GNSS support
• Voice call and SMS (Text/PDU format) support

• Multi-Technology Integrated: NB-IoT / Cat.M1 / EGPRS for EMEA / Australia
• Integrated GNSS (GPS, GLONASS, Galileo, BeiDou)
• LCC Package and AT commands mostly compatible with SIM900 and SIM800F 
• Embedded TCP(TLS) / UDP(DLS) / IPv4 / IPv6 stack
• Enhanced features: HTTP(s) / FTP / MQTT / EMAIL / LBS / NTP / DNS / PIN / CoAP / LwM2M / SMS / DFOTA / VoLTE / FileSystem / ALI_IOT
• Minimum power consumption and extended coverage / PSM & eDRX
• Extended temperature range: -40°C to +85°C

• Multi-Technology Integrated: NB-IoT / Cat.M1 / EGPRS for global market
• Integrated GNSS (GPS, GLONASS, Galileo, BeiDou)
• LCC Package and AT commands mostly compatible with SIM900 and SIM800F with Embedded TCP(TLS) / UDP(DLS) / IPv4 / IPv6 stack
• Enhanced features: HTTP(s) / FTP / MQTT / EMAIL / LBS / NTP / DNS / PING / CoAP / LwM2M / lSMS / DFOTA / VoLTE / FileSystem / ALI_IOT
• Minimum power consumption and extended coverage / PSM & eDRX
• Extended temperature range: -40°C to +85°C

• Multi band NB-IoT for EMEA market
• Compliant with 3GPP^TM Rel.13, SW updating to support Rel.14 in future
• Compact size: 17.6mm x 15.7mm x 2.3 mm
• LCC Package and AT commands mostly compatible with SIM800C (2G) to maximize the investments of customers by enabling a short time-to-market 
• Embedded TCP / UDP / IPv4 / IPv6 stack
• Enhanced features: SMS / HTTP(s) / PPP / NTP / DNS / PING / DFOTA / MQTT / CoAP / LwM2M / TLS(DTLS)
• Minimum power consumption and extended coverage / PSM & eDRX
• Extended temperature range: -40°C to +85°C

• With Power Save Mode (PSM) and Extended Discontinuous Reception (eDRX), the SIM7020G can extend battery life up to 10 years
• SIM7020G provides deeper coverage enhancement compared to GSM
• Both package and AT commands of SIM7020G are mostly compatible with SIM800C

• Multi-Band NB-IoT module solution in a SMT type
• With Power Save Mode (PSM) and Extended Discontinuous Reception (eDRX), it can extend battery life to 10 years
• Provides deeper coverage enhancement compared to GSM
• The package and AT commands are mostly compatible with SIM800C and SIM7020
• Strong extension capability with rich interfaces including UART, GPIO, etc., providing much flexibility and ease of integration for customer applications

• Supports wireless communication modes of Cat-M/Cat-NB/GPRS/EDGE
• Adopts LCC form factor and has a compact size of 24 mm x 24 mm which makes it ideal for compact products design
• Powerful expansibility with abundant interfaces including UART, GPIO, PCM, SPI, I²C, etc.
• Designed for applications that need low latency, low throughput data communication in a variety of radio propagation conditions
• Ideally suited for M2M applications, such as metering, asset tracking, remote monitoring, e-health, etc.
• With Power Saving Mode (PSM) and Extended Discontinuous Reception (eDRX), the SIM7070 series can extend battery life up to 10 years
• Provides deeper coverage enhancement compared to GSM
• The form factor and AT commands of the SIM7070 series are compatible with SIM7000X/SIM800F/SIM900

• With Power Saving Mode (PSM) and Extended Discontinuous Reception (eDRX), SIM7080G can extend battery life to 10 years
• LTE-M, NB-IoT dual mode
• The package of SIM7080G is compatible with SIM868
• Strong extension capability with rich interfaces including UART, GPIO, PCM, SPI, I²C, etc.
• The module provides much flexibility and ease of integration for customer's application
• Designed for applications that need low latency, low throughput data communication in a variety of radio propagation conditions

• With Power Saving Mode (PSM) and Extended Discontinuous Reception (eDRX), battery life can be extended up to 10 years
• Provides deeper coverage enhancement compared to GSM
• Ultra-compact size for wearable tracker application
• Adopts LGA form factor and has a compact size of 14.8 mm x 12.8 mm which makes it ideal for compact products design
• Powerful expansibility with abundant interfaces including UART, GPIO, PCM, SPI, I²C, etc.
• Designed for applications that need low latency, low throughput data communication in a variety of radio propagation conditions

• Multimode capability including low latency LTE Cat.1 connectivity
• Lowest cost LTE category module
• Low power consumption with extended idle and sleep mode (<5mA @sleep)
• IPv4v6 / IPv6 support
• GNSS supported (GPS, GLONASS) – standalone/assisted
• Extended temperature range of -40°C to +85°C
• Compact LGA type design (24mm x 27mm x 2.75 mm)
• Voice call and SMS (Text/PDU format) support

• Mini-PCIE interface with strong compatibility
• Suitable for LTE, UMTS, and GSM networks with global coverage
• Abundant software functions: FOTA, LBS, TLS, VoLTE
• Multi-constellation GNSS receiver support
• AT commands of the SIM7500-PCIE series are compatible with the SIM7600/SIM7600-H series modules

• Mini-PCIE interface with strong compatibility
• Suitable for LTE, UMTS and GSM networks with global coverage
• Abundant software functions: FOTA, LBS, TLS, VoLTE
• Multi-constellation GNSS receiver support
• AT commands of the SIM7500-PCIE series are compatible with the SIM7600/SIM7600-H series modules
• Analog audio coded integrated directly on the PCB

• Multi mode capability including low latency LTE Cat.1 connectivity
• Lowest cost LTE category module
• Low power consumption with extended idle and sleep mode (<5mA @sleep)
• IPv4v6 / IPv6 support
• GNSS supported (GPS, GLONASS, Beidou) – standalone/assisted
• Extended temperature range of -40°C to +85°C
• Compact LCC type design (30.0mm x 30.0mm x 2.9 mm) - unified form factor compatible with family of modules

• Multi mode capability including low latency LTE Cat.1 connectivity
• Lowest cost LTE category module
• Low power consumption with extended idle and sleep mode (<5mA @sleep)
• IPv4v6 / IPv6 support
• Optional GNSS interface supported (GPS, GLONASS, Beidou) – standalone/assisted
• Extended temperature range of -40°C to +85°C
• Mini-PCIE interface with strong compatibility

• Multi mode capability including low latency LTE Cat.1 connectivity
• Lowest cost LTE category module
• Low power consumption with extended idle and sleep mode (<5mA @sleep)
• IPv4v6 / IPv6 support
• Optional GNSS interface supported (GPS, GLONASS, Beidou) – standalone/assisted
• Extended temperature range of -40°C to +85°C
• Mini-PCIE interface with strong compatibility
• In-built support for coded analog audio

• Multi mode capability including high speed connectivity thanks to LTE Cat.4
• IPv6 support
• VoLTE support
• GNSS supported (GPS, GLONASS)
• Extended temperature range of -40°C to +85°C
• Compact design (30mm x 30mm x 2.9 mm)
• Two variants available – miniPCIe and LCC
• Voice call and SMS (Text/PDU format) support

• Multi mode capability including high speed connectivity thanks to LTE Cat.4
• IPv6 support
• Firmware over the air (FOTA) updates
• GNSS supported (GPS, GLONASS)
• Extended temperature range of -40°C to +85°C
• VoLTE support
• Voice call and SMS (Text/PDU format) support
• Compact design (30mm x 30mm x 2.9mm)

• LCC+LGA form factor with abundant interfaces
• Suitable for LTE, UMTS and GSM networks with global coverage
• Abundant software functions: FOTA, TLS, VoLTE
• Multi-constellation GNSS receiver support
• Extreme operating temperature range -40°C to +85°C

• LCC+LGA form factor with abundant interfaces
• Suitable for LTE, UMTS and GSM networks with global coverage
• Abundant software functions: FOTA, TLS, VoLTE
• Optional: Multi-constellation GNSS receiver support
• Extreme operating temperature range -40°C to +85 °C

• Compact size with abundant interfaces
• Abudant software functions: FOTA, SSL, LBS
• High performance Mulit-GNSS receiver integrated
• Form factor is compatible with the A7672/SIM7000/SIM7070 series and 2G SIM800F/SIM800

• Compact size with abundant interfaces
• Abudant software functions: FOTA, SSL,
• LBS High performance Mulit-GNSS receiver
• integrated Form factor is compatible with the A7672/SIM7000/SIM7070 series and 2G SIM800F/SIM800

• LGA interface with strong compatibility
• Suitable for LTE, HSPA+ networks with global coverage
• Abundant software functions: FOTA, SSL, TLS
• Multi-constellation GNSS receiver support

• Multi mode capability including low latency LTE Cat.6 connectivity
• Operating temperature range of -30°C to +70°C
• M.2 interface with high compatibility
• Abundant software functions: FOTA, SSL, TLS
• Multi-constellation GNSS receiver support
• Industry standard design (42mm x 30mm x 2.3mm)
• Suitable for LTE, HSPA+ networks with global connectivity

• Multimode capability including low latency LTE Cat.6 connectivity
• Operating temperature range of -30°C to +70°C
• M.2 interface with high compatibility
• Abundant software functions: FOTA, SSL, TLS
• Multi-constellation GNSS receiver support
• Industry standard design (42mm x 30mm x 2.3mm)
• Suitable for LTE, HSPA+ networks with global connectivity

• LGA interface with strong compatibility
• Suitable for LTE, HSPA+ networks with global coverage
• Abundant software functions: FOTA, SSL, TLS
• Multi-constellation GNSS receiver support

• M2 form factor with various interfaces
• Suitable for LTE, HSPA+ networks with global coverage
• Hudge data transmission
• AT commands of SIM7912G-M2 compatible with SIM79XX series modules

• Multi-Band 5G NR/LTE-FDD/LTE-TDD/HSPA+ module which adopts LGA form factor
• Supports Rel.15 5G NSA/SA up to 2.4Gbps data transfer
• Strong extension capability with abundant interfaces including PCIe, USB3.1, GPIO etc.
• Multi-constellation GNSS receiver available for applications requiring fast and accurate fixes in any environment
• Due to the unique combination of performance, security and flexibility, this module is suited for many applications

• 5G/4G/3G multi-mode module with M.2 form factor, optimized for IoT and eMBB applications
• Both NSA and SA modes supported
• Supports a wide range of supported LTE/5G NR frequency bands commonly used in many different regions of the world
• Downlink/Uplink MIMO (4x4/2x2), ENDC/LTE carrier aggregations
• Multi-constellation GNSS receiver available for applications requiring fast and accurate fixes in any environment
• Backwards compatible module, to help facilitate the migration and differentiation between 4G LTE and 5G

• Multi-Band 5G NR/LTE-FDD/LTE-TDD/HSPA+ module which adopts M.2 form factor
• Supports Rel.15 5G NSA/SA up to 2.4Gbps data transfer
• Strong extension capability with abundant interfaces including PCIe, USB3.1, GPIO etc.
• Multi-constellation GNSS receiver available for applications requiring fast and accurate fixes in any environment
• Due to the unique combination of performance, security and flexibility, this module is suited for many applications

• LGA form factor with various interfaces
• Huge data transmission
• AT commands of SIM8260E compatible with SIM8200 series modules

• M2 form factor with various interfaces
• Huge data transmission
• AT commands of SIM8262E-M2 compatible with SIM8200 series modules

• Supports wireless communication modes of Cat-M/Cat-NB/GPRS/EDGE  
• Adopts LCC form factor and has a compact size of 24 mm x 24 mm which makes it ideal for compact products design  
• Powerful expansibility with abundant interfaces including UART, GPIO, PCM, SPI, I2C, etc.  
• Ideally suited for M2M applications, such as metering, asset tracking, remote monitoring, e-health, etc.  
• With Power Saving Mode (PSM) and Extended Discontinuous Reception (eDRX), the SIM7070 series can extend battery life up to 10 years  
• Provides deeper coverage enhancement compared to GSM  
• The form factor and AT commands of the SIM7070 series are compatible with SIM7000X/SIM800F/SIM900  

• Multi-band multi-chip System-in-Package (SiP) supporting 5G Massive IoT (LTE-M/NB-IoT) platforms
• Integrates the entire RF front end, transceiver, power management, memory, and baseband modem
• LTE multi-band radio operating in the 698 to 2200 MHz frequency range
• NOR flash, crystals, and a few passives external to the package complete the SiP implementation

• NB-IoT (NB2, Release 15) industrial module series with GNSS capability 
• Ultra-compact size 
• Ultra low power mode <3µA 
• Worldwide regional bands coverage 

• Wide high speed connectivity capability (LTE Cat.3)
• IPv6 support
• GNSS supported (GPS, GLONASS)
• Extended temperature range of -40°C to +85°C
• Voice call and SMS (Text/PDU format) support
• Compact design (29mm x 33mm x 2.3mm)

• Low-cost device
• Extended temperature range of -40°C to +90°C
• Compact design (27.6mm x 18.8mm x 2.7mm)
• Voice call and SMS (Text/PDU format) support
• 3GPP^TM Rel.99 support
• Low power consumption

• Low-cost device
• Low power comsumption
• Quad band 850, 900, 1800, 1900 MHz
• Compact design (27.6mm x 18.8mm x 2.7mm)
• Voice call and SMS (Text/PDU format) support
• 3GPP^TM Rel.99
• Extended temperature range of -40°C to +90°C

• Ideal for long life solutions such as metering, tracking and tracing and remote maintenance and control
• Quad-Band GSM (850, 900, 1800, 1900MHz) and GPRS class 12 for global connectivity
• Optimized power supply design and advanced power management system extends battery life and improves Total Cost of Ownership (TCO)
• An embedded IP stack with IPv4 support provides Internet service that is protected by an advanced security concept including TLS/DTLS support and jamming detection
• A dual SIM with smart switching technology securely manages the connection to cellular networks and encrypts data
• Customer manufacturing support services simplify the device test method (RF TX Wave Generation / RX Power Measurement) and provide a simplified set-up for customer manufacturing processes

• Low-cost device
• Low power consumption
• Quad band 850, 900, 1800, 1900 MHz
• Compact design (27.6mm x 18.8mm x 2.7mm)
• Voice call and SMS (Text/PDU format) support
• 3GPP^TM Rel. 6
• Extended temperature range of -40°C to +85°C

• Full-featured, truly industrial and scalable platform with leading-edge LGA technology
• Powerful processor large memory
• Quad band
• GPRS/EDGE class 12

• Dual band UMTS and GSM
• Operating Temperature: -40°C to +90°C
• 3GPP^TM Rel.7 compliant
• JAVA embedded

• UMTS Penta band support
• GSM Quad band support
• Operating Temperature: -40°C to +90°C
• 3GPP^TM Rel.7 compliant
• JAVA embedded
• Integrated FOTA
• RLS monitoring

• LTE Cat.1
• Incremental firmware update over-the-air
• IPv6 support
• Extended temperature range of -40°C to +85°C
• SMS (Text/PDU format) support
• Compact design (27.6mm x 25.4mm x 2.2mm)

• 2G/LTE Cat.1bis 3GPP Release 13 compliant single antenna module with RPM support
• Regional LTE coverage in EMEA, with VoLTE and 2G fallback
• Uplink up to 5.2 Mbps, Downlink up to 10.2 Mbps
• Easy Connectivity (eSIM support) and Lifecycle Management (FOTA)
• Easy migration from Cinterion® 2G/3G/LTE Cat.1 modules

• 2G/LTE Cat.1bis 3GPP Release 13 compliant single antenna module with RPM support
• Regional LTE coverage in EMEA/LATAM/India, with VoLTE and 2G fallback
• Uplink up to 5.2 Mbps, Downlink up to 10.2 Mbps
• Easy Connectivity (eSIM support) and Lifecycle Management (FOTA)
• Easy migration from Cinterion® 2G/3G/LTE Cat.1 modules

• LTE Cat.4 Connectivity with 2G/3G Fallback
• LTE (FDD) 3GPP^TM Rel.9 compliant protocol stack, with DL-MIMO/RX-Diversity
• Secure connection with TLS
• TCP/IP stack access via AT command and transparent TCP/UDP services
• Incremental firmware update over-the-air
• Java^TM embedded

• Penta band NB-IoT (3, 5, 8, 20, 28) connectivity with deep indoor coverage and extended range
• Multi-design capability (LGA) compatible with Gemalto’s comprehensive suite of solutions, services and platforms that help enterprises Connect, Secure and Monetize^TM IoT technology
• Advanced power management system extends battery lifetime and improves TCO
• Embedded IP stack supports a range of internet services protected by an enhanced security concept
• Incremental Firmware Over The Air (FOTA) updates for saving power, bandwidth and battery life
• Optional embedded secure element for an added layer of security for extra-sensitive applications
• Optional integrated eSIM and Bearer Independent Protocol support

• Multimode support: LTE-M, NB-IoT
• eSIM – Remote provisioning
• Advanced power management system
• Embedded IP stack
• Incremental FOTA updates
• Embedded processing
• State of the art security
• Multi design capability (LGA)
• Secure cloud enrollment

• Multimode support: LTE-M, NB-IoT, 2G
• eSIM - Remote provisioning
• Advanced power management system
• Embedded IP stack
• Incremental FOTA updates
• Embedded processing
• State of the art security
• Multi design capability (LGA)
• Secure cloud enrollment

• Support of 5G sub-6 FDD and TDD for global deployment
• Support of SA and NSA operations for full network compatibility
• 5G Rel. 15, 4G Cat 20 up to 7 CA, 3G HSPA+ Rel. 8 for fallback to legacy networks
• Intraband and interband UL CA supported on 4G networks for better throughput performance for Uplink-centric applications, like surveillance cameras and 4K/8K video streaming
• State-of-the-art GNSS receiver with double frequency GPS (Band L1/L5) for better accuracy

• Support of 5G sub-6 FDD and TDD for global deployment
• Support NSA operations only, 5G core network opt. 3a/3x for full network compatibility
• Latest gen. 4G/5G Rel.16, 4G Cat19 - 5CA
• Intra-/interband UL CA supported on 4G networks for better throughput performance for UL-centric applications e.g. surveillance cameras, 4K/8K video streaming
• 3G HSPA+ Rel. 8 fallback to legacy networks
• Support for PCIe Gen 3 and USB 3.1 Gen 2 for maximum application design flexibility
• Dedicated/shared (switchable) RF path/connector for GNSS L1 to allow total flexibility in the design phase and low losses whenever high sensitivity is required

• Support of 5G sub-6 FDD and TDD for global deployment
• Support NSA operations only, 5G core network opt. 3a/3x for full network compatibility
• Latest gen. 4G/5G Rel.16, 4G Cat20 - 7 CA
• Intra-/interband UL CA supported on 4G networks for better throughput performance for UL-centric applications e.g. surveillance cameras, 4K/8K video streaming
• 3G HSPA+ Rel. 8 for fallback to legacy networks
• Support for PCIe Gen 3 and USB 3.1 Gen 2 for maximum application design flexibility
• Dedicated/shared (switchable) RF path/connector for GNSS L1 to allow total flexibility in the design phase and low losses whenever high sensitivity is required

• Automated manufacturing process with friendly, miniature, and futureproof footprint
• BT 4.0 Transceiver
• GPS, GLONASS, Galileo and Beidou navigation
• Ideal solution for applications such as asset management, utilities, and telematics
• Battery friendly operation with 2.8V GPIOs

• Easy and low cost to integrate in small application sizes because of ultra-compact and robust LGA package
• Easy to use in mass-production automated manufacturing

• 4 GSM/GPRS bands support
• Unified xE910 family form factor
• Python script interpreter
• GNSS supported
• Extended temperature range
• 2MB memory for application, 2MB RAM Voice call and SMS support
• Compact design (28.20mm × 28.20mm × 2.25mm)

• Design once and deploy globally, thanks to xE910 unified form factor
• Perfect platform for medium-to-high-volume IoT applications

• 4 GSM/GPRS bands support
• ARM 11 processor and onboard memory to run applicatioin in the module
• Unified xE910 family form factor
• Python script interpreter Idela for 2G applications for OEM and aftermarket automotive
• Voice capable for applications requiring either analog or digital
• Extended temperature range eCall compliant
• Voice call and SMS support
• Compact design (28.20mm × 28.20mm × 2.25mm)

• Cost-optimized, long-term available 2G variant
• Two ITU-T V.24 UART interfaces, ten 1.8 V I/O ports

• Automated manufacturing process friendly product in its small compact LCC/VQFN packaging
• Battery friendly operation with 1.8V GPIOs
• Easy to bandle with external GPS | GLONASS receivers
• Over-the-Air firmware update by means of Premium FOTA Management
• Complete SMT platform for M2M solutions with embedded Python Script Interpreter
• Jamming detection
• Ideal for security alarms, automated meter reading, and POS terminals; (with external GPS) fleet management, tracking

• 2 GSM/GPRS bands support
• Full HW and SW compatibility with previous V3 generation – direct replacement path
• Pin-to-pin compatibility with 3G variant – UL865
• Recommended for new 2G cost-sensitive designs
• Recommended for applications requiring ultra low power consumption
• Ideal for applications in security alarm systems, automated meter readings and POS terminals GNSS supported – external module needed
• Python script interpreter
• 800 kB memory for application, 1 MB RAM
• Voice call and SMS support
• Compact design (24.4mm × 24.4mm × 2.6mm)

• Automated manufacturing process friendly product in its small footprint
• Battery friendly operation with 1.8 V GPIOs
• Easy to bandle with external GPS | GLONASS receivers
• Over-the-Air firmware update by means of Premium FOTA Management
• Complete SMT platform for M2M solutions with embedded Python Script Interpreter
• Jamming detection
• Ideal for security alarms, automated meter reading, and POS terminals; (with external GPS) fleet management, tracking

• 4 GSM/GPRS bands support
• Full HW and SW compatibility with previous V3 generation – direct replacement path
• Pin-to-pin compatibility with 3G variant – UL865
• Recommended for new 2G cost-sensitive designs
• Recommended for applications requiring ultra low power consumption
• Ideal for applications in security alarm systems, automated meter readings and POS terminals GNSS supported – external module needed
• Python script interpreter
• 800 kB memory for application, 1 MB RAM Voice call and SMS support
• Compact design (24.4mm × 24.4mm × 2.6mm)

• Design once and deploy globally, thanks to xE910 unified form factor
• Perfect platform for a wide range of applications requiring HSPA connectivity
• LGA package ideal for low profile integrated solutions, reducing cost and saving space and weight in portable devices
• Built-in UDP/IP and TCP/IP stacks
• Supports IoT LOCATE, a Telit portal-based service providing device’s position based on observed cellular Cell-IDs
• Suited for a wide range of industrial and consumer applications with high data throughput requirements, including asset & fleet tracking, telematics, PDAs, security surveillance, personal navigation devices, e-readers and consumer electronics

• Easy to integrate with peripherals and actuators using USB 2.0 HS, UART and user definable GPIOs
• Ideal platform for IoT applications and devices with ultra-compact design and extended operating temperature range
• Internet friendly with integrated TCP/IP and UDP/IP stacks, as well as HTTP, SMTP, FTP, SSL
• Simple drop-in migration and technology design reuse path to 2G and 3G with any xE910 module
• Over-the-Air firmware update

• Easy to integrate with peripherals and actuators using USB 2.0
• HS, UART and user definable GPIOs Increased connectivity performance with MIMO 2x2
• Ideal platform for IoT applications and devices with ultra-compact design and extended operating temperature range
• Internet friendly with integrated TCP/IP and UDP/IP stacks, as well as HTTP, SMTP, FTP, SSL
• Simple drop-in migration and technology design reuse path to 2G and 3G with any xE910 module
• Over-the-Air firmware update
• Bundle options with Telit GNSS solutions

• MTC features ready according to 3GPP^TM Rel.12
• Easy to integrate with peripherals and actuators using USB 2.0 HS, UART and user definable GPIOs
• Internet friendly with integrated TCP/IP and UDP/IP stacks
• Simple drop-in migration and technology design reuse path to 2G and 3G with any xE910 module
• Over-the-Air firmware update
• Embedded GNSS solution

• Standard Mini PCIe Data-card form factor
• LTE Cat.1 support, best-in class 3GPP^TM Rel.10 platform
• Easy to integrate with peripherals and actuators using USB 2.0 HS, UART, and user definable GPIOs
• Battery-friendly 1.8V GPIO
• Ideal platform for IoT applications, mobile data, and computing devices, with ultra-compact design and extended operating temperature range
• Internet-friendly with integrated TCP/IP and UDP/IP stacks
• Simple drop-in migration and technology design re-use path to 2G and 3G with any xE910 module
• Over-the-Air firmware update

• MTC features ready according to 3GPP^TM Rel.12
• Easy to integrate with peripherals and actuators using USB 2.0 HS, UART and user definable GPIOs
• Internet friendly with integrated TCP/IP and UDP/IP stacks
• Simple drop-in migration and technology design reuse path to 2G and 3G with any xE910 module
• Over-the-Air firmware update
• Embedded GNSS solution

• MTC features ready according to 3GPP^TM Rel.12
• Easy to integrate with peripherals and actuators using USB 2.0 HS, UART and user definable GPIOs
• Internet friendly with integrated TCP/IP and UDP/IP stacks
• Simple drop-in migration and technology design reuse path to 2G and 3G with any xE910 module
• Over-the-Air firmware update
• Embedded GNSS solution

• MTC features ready according to 3GPP^TM Rel.12
• Easy to integrate with peripherals and actuators using USB 2.0 HS, UART and user definable GPIOs
• Internet friendly with integrated TCP/IP and UDP/IP stacks
• Simple drop-in migration and technology design reuse path to 2G and 3G with any xE910 module
• Over-the-Air firmware update
• Embedded GNSS solution

• MTC features ready according to 3GPP^TM Rel.12
• Easy to integrate with peripherals and actuators using USB 2.0 HS, UART and user definable GPIOs
• Internet friendly with integrated TCP/IP and UDP/IP stacks
• Simple drop-in migration and technology design reuse path to 2G and 3G with any xE910 module
• Over-the-Air firmware update
• Embedded GNSS solution

• Standard Mini PCIe Data-card form factor
• LTE Cat.4 support, best-in class 3GPP^TM Rel.10 platform
• Easy to integrate with peripherals and actuators using USB 2.0 HS, UART, and user definable GPIOs
• Battery-friendly 1.8V GPIO
• Ideal platform for IoT applications, mobile data, and computing devices, with ultra-compact design and extended operating temperature range
• Internet-friendly with integrated TCP/IP and UDP/IP stacks
• Simple drop-in migration and technology design re-use path to 2G and 3G with any xE910 module
• Over-the-Air firmware update

• MTC features ready according to 3GPP^TM Rel.12
• Easy to integrate with peripherals and actuators using USB 2.0 HS, UART and user definable GPIOs
• Internet friendly with integrated TCP/IP and UDP/IP stacks
• Simple drop-in migration and technology design reuse path to 2G and 3G with any xE910 module
• Over-the-Air firmware update
• Embedded GNSS solution

• MTC features ready according to 3GPP^TM Rel.12
• Easy to integrate with peripherals and actuators using USB 2.0 HS, UART and user definable GPIOs
• Internet friendly with integrated TCP/IP and UDP/IP stacks
• Simple drop-in migration and technology design reuse path to 2G and 3G with any xE910 module
• Over-the-Air firmware update
• Embedded GNSS solution

• 2G/LTE Cat.1 bis module optimized for M2M and IoT applications
• Ideal for medium and low-rate communication solutions
• Internet friendly with integrated TCP/IP and UDP/IP stacks
• Suitable for IoT applications that need a smooth migration from sunsetting 2G and 3G networks
• Support for frequency bands of major operators in Europe

• New member of Telit’s flagship xE910 module family
• 2G/LTE Cat.1 3GPP^TM Release 9-compliant, single antenna module
• Uplink up to 5 Mbps, Downlink up to 10Mbps
• Internet friendly with integrated TCP/IP and UDP/IP stacks, as well as HTTP, HTTPS, NTP, FTP, PPP
• Ideal platform for IoT applications and devices with ultra-compact design and extended operating temperature range

• New member of Telit’s flagship xE910 module family
• 2G/LTE Cat.1 3GPP^TM Release 9-compliant single antenna module
• Uplink up to 5 Mbps, Downlink up to 10Mbps
• Internet friendly with integrated TCP/IP and UDP/IP stacks, as well as HTTP, HTTPS, NTP, FTP, PPP
• Ideal platform for IoT applications and devices with ultra-compact design and extended operating temperature range
• Embedded GNSS receiver makes it ideal for all-in-one tracking use cases

• Standard mPCIe data card form factor
• LTE Cat.18: Exceptional high speed with data rates of up to 1.2 Gbps download and 150 Mbps upload
• Support for Uplink 2xCA and up to 5xCA on Downlink with 4x4 MIMO, 256QAM
• Ample LTE frequency band support
• 3G fallback technology
• Wide range of operating temperatures

• Small size and low power consumption
• Compliant to 3GPP^TM Rel.14 Cat.M1/NB2, tailored for IoT devices
• An ideal solution for medical devices, fitness trackers, industrial sensors, smart meters, and other global mass-production, mass-deployment applications
• Module sizes ranging from 300 mm² to below 200 mm² on a fixed 94-pad LGA footprint enable a “design once, use anywhere” IoT device
• Support for Telit OneEdge innovative module-embedded software system with pre-packaged, secure, easy-to-use deployment and management tools

• Small size and low power consumption
• Compliant to 3GPP^TM Rel.14 Cat.M1/NB2, tailored for IoT devices
• 2G fallback ensures the best service in regions with mixed LTE-M/NB-IoT and 2G network coverage
• An ideal solution for medical devices, fitness trackers, industrial sensors, smart meters, and other global mass-production, mass-deployment applications
• Module sizes ranging from 300 mm² to below 200 mm² on a fixed 94-pad LGA footprint enable a “design once, use anywhere” IoT device
• Support for Telit OneEdge innovative module-embedded software system with pre-packaged, secure, easy-to-use deployment and management tools

• Industry popular xE910 form factor futureproofed to 5G 
• Tri-band Mobile IoT (Cat.NB1 & M1) support for pan-European deployment
• Telit AppZone C runs customer applications directly in the module
• Superior Telit Engineering power-saving and RF performance
• Optional embedded full-featured GNSS functionality
• Support for Telit OneEdge innovative module-embedded software system with pre-packaged, secure, easy-to-use deployment and management tools

• Industry popular xE910 form factor futureproofed to 5G 
• Tri-band Mobile IoT (Cat.NB1/M1) support with 2G fallback for pan-European deployment
• Telit AppZone C runs customer applications directly in the module
• Superior Telit Engineering power-saving and RF performance
• Optional embedded full-featured GNSS functionality
• Support for Telit OneEdge innovative module-embedded software system with pre-packaged, secure, easy-to-use deployment and management tools

• Design once and deploy globally with the swappable xE910 form factor family
• Perfect platform for IoT applications such as smart metering, security & surveillance, point of sale, health monitoring, fleet management, asset tracking and wearable devices
• Worldwide Single-SKU with multi-band support: B1, B2, B3, B4, B5, B8, B12, B13, B18, B19, B20, B26, B28
• Support for Telit OneEdge innovative module-embedded software system with pre-packaged, secure, easy-to-use deployment and management tools

• Standard mini PCIe data card form factor
• Perfect platform for IoT applications such as smart metering, security & surveillance, point of sale, health monitoring, fleet management, asset tracking and wearable devices
• Worldwide Single-SKU with multi-band support: B1, B2, B3, B4, B5, B8, B12, B13, B18, B19, B20, B26, B28
• Support for Telit OneEdge innovative module-embedded software system with pre-packaged, secure, easy-to-use deployment and management tools

• Design once and deploy globally with the xE910 28.2 x 28.2 x 2.2 mm form factor family
• An ideal solution for global IoT applications such as smart metering, security and surveillance, point of sales, health monitoring, fleet management, and asset tracking
• Compliant to 3GPP^TM Rel.14 Cat.M1/NB2, tailored for IoT
• Support for Telit OneEdge innovative module-embedded software system with pre-packaged, secure, easy-to-use deployment and management tools

• Design once and deploy globally with the xE910 28.2 x 28.2 x 2.2 mm form factor family
• An ideal solution for global IoT applications such as smart metering, security and surveillance, point of sales, health monitoring, fleet management, and asset tracking
• Compliant to 3GPP^TM Rel.14 Cat.M1/NB2, tailored for IoT
• 2G fallback ensures the best service in regions with mixed LTE-M/NB-IoT and 2G network coverage
• Support for Telit OneEdge innovative module-embedded software system with pre-packaged, secure, easy-to-use deployment and management tools

• Standard mini PCIe data card form factor
• An ideal solution for global IoT applications such as smart metering, security and surveillance, point of sales, health monitoring, fleet management, and asset tracking
• Compliant to 3GPP^TM Rel.14 Cat.M1/NB2, tailored for IoT
• 2G fallback ensures the best service in regions with mixed LTE-M/NB-IoT and 2G network coverage
• Support for Telit OneEdge innovative module-embedded software system with pre-packaged, secure, easy-to-use deployment and management tools

• Design once and deploy globally, thanks to the xL865 form factor family
• Compact VQFN package
• Perfect platform for regional IoT applications
• 3GPP^TM Release 13 LTE UE Category M1/NB1-compliant
• Support for Telit OneEdge innovative module-embedded software system with pre-packaged, secure, easy-to-use deployment and management tools

• Smallest 5G data card on the market
• Unique shielding and PCB design for class-leading performance and thermal efficiency
• PCIe/USB Interface on the same SKU
• Penetration tested security by design
• GNSS positioning enhanced by L5 support

• Design once and deploy globally with the xL865 form factor family
• LTE UE Cat-M1/NB2, compliant to the latest 3GPP^TM Rel.14 enhanced machine-type communication (MTC), with 2G fallback
• Optimized for low power consumption and wide area coverage
• Compact VQFN package is ideally suited for low profile integrated solutions, limited real estate application boards, reducing costs in high-volume applications and saving space and weight in portable devices
• The perfect platform for IoT applications, such as smart metering, health monitoring, fleet management and asset tracking

• Small size and low power consumption
• Optimized for ease-of-design, high yield and low-cost manufacturing
• Compliant to 3GPP^TM Release 14 Cat NB2, tailored for IoT devices
• Ideal solution for medical devices, fitness trackers, industrial sensors, smart meters, and other mass-production, mass-deployment applications
• Module sizes ranging from 300 down to below 200 mm² on a fixed 94-pad LGA footprint enable a “design once, use anywhere” IoT device strategy

• Small form factor ideal for size-constrained applications
• Ultra-low power consumption
• 3GPP^TM Rel.14 Cat-NB2 evolution in the new Telit form factor xE310
• Perfect platform for global IoT applications such as smart metering, smart agriculture, health monitoring and asset tracking

• Small form factor ideal for size-constrained applications
• Ultra-low power consumption 3GPP^TM Rel.14 Cat-NB2 evolution in the new Telit form factor xE310
• Perfect platform for global IoT applications such as smart metering, smart agriculture, health monitoring and asset tracking
• 2G fallback to guarantee coverage also in those areas where NB-IoT is not yet available

• Design once and deploy globally, thans to xE866 form factor family
• Very small LGA package ideally suited for low profile integrated solutions, limited real estate application boards
• Perfect platform for regional IoT applications such as smart metering, security & surveillance, POS, health monitoring, fleet management, asset tracking and wearables
• LTE UE Category NB1 compliant to latest 3GPP Rel.13 enhanced Machine-Type-Communications (eMTC), specifically designed for IoT use cases
• Minimum power consumption and extended coverage
• Embedded UDP/IP stack
• Extended temperature range: -40°C to +85°C

• Industry popular xE910 form factor futureproofed to 5G 
• Cost-optimized dual-band Cat.NB1 support for pan-European deployment
• Telit AppZone C runs customer applications directly in the module
• Superior Telit Engineering power-saving and RF performance
• Optional embedded full-featured GNSS functionality

• Compliant to 3GPP^TM Release 14 Cat.NB2, tailored for IoT devices
• Ideal solution for smart meters, industrial sensors, medical devices, asset tracking and wearable devices
• Multiple bands supported for worldwide deployment
• Design once and deploy globally, thanks to the xL865 form factor family

• IoT-optimized power management
• LTE Cat.1 module optimized for M2M and IoT applications
• Complete and seamless global IoT connectivity
• Cell-ID based location
• Supports extended temperature range of -40°C to +90°C
• Very easy to integrate by simply plugging into an existing 52-pin express card slot

• IoT-optimized power management
• LTE Cat.3 module optimized for M2M and IoT applications
• Complete and seamless global IoT connectivity
• Integrated GPS/GLONASS/GALILEO solution
• Extended temperature range of -40°C to +90°C
• Very easy to integrate by simply plugging into an existing 52-pin express card slot

• 3G/LTE/5G Cat.20 module based on the Qualcomm SDX55 chipset
• Both 5G modes: NSA and SA are supported
• Supports a wide range of supported LTE/5G NR frequency bands commonly used in many different regions of the world
• Downlink/Uplink MIMO (4x4 / 2x2), EN-DC/LTE carrier aggregations
• Multi-constellation GNSS receiver available for applications requiring fast and accurate fixes in any environment
• Backwards compatible module, to help facilitate the migration and differentiation between 4G LTE and 5G

• The thinnest 3G LGA module in the market
• Penta band 3G
• Quad band 2G
• HSDPA Cat.10 / HSUPA Cat.6 data rates
• Standalone GPS/GLONASS and A-GPS support

• Wide high speed connectivity capability (LTE Cat.3)
• IPv6 support
• GNSS supported (GPS, GLONASS)
• Extended temperature range of -40°C to +85°C
• Voice call and SMS (Text/PDU format) support
• Compact design (29mm x 33mm x 2.2mm)

• Twelve worldwide LTE bands (LTE Cat. 1)
• Free firmware updates over the air (FOTA)
• IPv6 support
• Extended temperature range of -40°C to +90°C
• SMS (Text/PDU format) support
• Compact design (33mm x 29mm x 2.3 mm)

• LTE Cat.1 module optimized for M2M and IoT applications
• Worldwide LTE, UMTS/HSPA+ and GSM/GPRS/EDGE coverage
• Embedded TCP/IP stack to easily communicate over the internet
• Flexible I/O Voltage
• GNSS receiver enables tracking and location-based services

• LTE Cat.1 module optimized for M2M and IoT applications
• Worldwide LTE, UMTS/HSPA+ and GSM/GPRS/EDGE coverage
• Embedded TCP/IP stack to easily communicate over the Internet
• Flexible I/O voltage
• GNSS receiver enables tracking and location-based services

• Multiple MTC technologies for global connectivity - 3GPP^TM Rel.14 Cat.M1, Cat.NB1, and Cat.NB2
• Breakthrough Things footprint - Compact form factor developed for the needs of small, battery-operated devices, with large surface pads for improved soldering and reduced SMT warpage
• Ultra-integrated for lower Total Cost of Ownership - Application processor and embedded GNSS with multi constellation
• State-of-the-art and secure - Pre-provisioned digital identities in the roof of device, embedded eSIM option, and secure key store
• Easy connectivity and lifecycle management - Remote update and device management, secure enrollment into main cloud platforms including AWS IoT Core or Azure IoT Hub

• Multiple MTC technologies for global connectivity - 3GPP^TM Rel.14 Cat.M1, Cat.NB1, Cat.NB2, and 2G
• Breakthrough Things footprint - Compact form factor developed for the needs of small, battery-operated devices, with large surface pads for improved soldering and reduced SMT warpage
• Ultra-integrated for lower Total Cost of Ownership - Application processor and embedded GNSS with multi constellation
• State-of-the-art and secure - Pre-provisioned digital identities in the roof of device, embedded eSIM option, and secure key store
• Easy connectivity and lifecycle management - Remote update and device management, secure enrollment into main cloud platforms including AWS IoT Core or Azure IoT Hub

• Smallest module in Telit’s 3G portfolio
• Design once and deploy globally, with the xE866 pinto-pin compatible form factor family
• Compact LGA package is ideally for low profile integrated solutions with space constraints, reducing costs and weight
• Over the air firmware update
• Built-in UDP/TCP/FTP/SMTP stack, IP stack with TCP and UDP protocol
• Supports IoT LOCATE, a Telit portal-based service providing device’s position based on observed cellular Cell-IDs
• Ideal solution for applications in wearables, telematics, UBI applications, fleet management and asset tracking

• Design once and deploy globally, thanks to xE910 unified form factor
• Voice-capable for Applications requiring digital (DVI) interface
• LGA package ideal for low profile integrated solutions, reducing cost and saving space and weight in portable devices
• Built-in UDP/IP and TCP/IP stacks
• Supports IoT LOCATE, a Telit portal-based service providing device’s position based on observed cellular Cell-IDs
• Perfect platform for regional applications such as vending systems, POS, smart grid, security and surveillance
• Ideal solution for Applications in wearables, telematics, UBI applications, fleet management and asset tracking

• Simple drop-in migration and technology upgrade path to 3G high-speed performance for designs using GL865-DUAL V3
• Voice-capable for Applications requiring digital (DVI) interface
• Battery-friendly 1.8 V GPIO
• Over the air firmware update (Premium FOTA management)
• Built-in UDP/IP and TCP/IP stacks
• Complete SMT platform for IoT solutions running customer application inside module with embedded Python script interpreter
• Designed for use in POS terminals, Health monitoring, security alarms with cameras, handheld scanners, logistics devices and battery powered devices
• Ideal solution for fleet management and asset tracking when pairing with external GPS|GLONASS receivers

• LTE Cat.4 module optimized for M2M and IoT applications
• Worldwide LTE, UMTS/HSPA+ and GSM/GPRS/EDGE coverage
• Embedded TCP/IP stack to easily communicate over the Internet
• Flexible I/O voltage
• GNSS receiver enables tracking and location-based services

• LTE Cat.4 module optimized for M2M and IoT applications
• Worldwide LTE, UMTS/HSPA+ and GSM/GPRS/EDGE coverage
• Embedded TCP/IP stack to easily communicate over the Internet
• Flexible I/O voltage
• GNSS receiver enables tracking and location-based services

• Multiple MTC technologies for global connectivity - 3GPPTM Rel.14 Cat.M1, Cat.NB1, Cat.NB2 
• Breakthrough Things footprint - Compact form factor developed for the needs of small, battery-operated devices, with large surface pads for improved soldering and reduced SMT warpage 
• Ultra-integrated for lower Total Cost of Ownership - Application processor and embedded GNSS with multi constellation 
• State-of-the-art and secure - Pre-provisioned digital identities in the roof of device, embedded eSIM option, and secure key store 

• Ultra small size (14.2mm x 14.2mm) for easy manufacturing
• Ultra low power consumption: <4.1µA in Deep Sleep Mode
• Extended temperature range of -40ºC to +85ºC
• NIDD support (Non-IP Data Delivery)
• Made in Lithuania

• 5G/4G multi-mode module with LGA form factor, optimized for IoT and eMBB applications
• Both 5G modes: NSA and SA are supported
• Supports a wide range of supported LTE/5G NR frequency bands commonly used in many different regions of the world
• Downlink/Uplink MIMO (4x4/2x2), ENDC/LTE carrier aggregations
• OpenCPU with comprehensive SDK
• High speed interface drivers for multi OS

• World's smallest LTE Cat 4 module with global coverage and extensive MNO certifications
• Focused product variants to reduce logistics complexity
• Any region, any band, any technology for simple roaming and deployment anywhere in the world
• Secure by design to always keep your device running and updated
• Ideal for size-constrained devices

• LTE Cat.1 modules with 2G or 3G fallback
• Voice support via VoLTE or CSFB Cellular location service and hybrid positioning
• Small, compact LARA LGA form factor for easy manufacturing
• Easy migration between u-blox 2G, 3G, and 4G modules

• World's smallest LTE Cat 1 module with global coverage and extensive MNO certifications
• Focused product variants to reduce logistics complexity
• Any region, any band, any technology for simple roaming and deployment anywhere in the world
• Secure by design to always keep your device running and updated
• Ideal for size-constrained devices

• Powerful LTE modules in industry‑standard Mini PCIe package
• Highest throughput of up to 150 Mb/s with LTE Cat.4
• Easy migration between u-blox 2G, 3G, and 4G modules
• 6 LTE bands Deliver critical firmware updates over the air
• Manufactured in ISO/TS 16949 certified production sites
• Extreme operating temperature range -40°C to +85°C

• Automotive-grade and ATEX-certified options
• Very small SARA LGA form factor for easy manufacturing
• Industry-leading, low power consumption (<0.90 mA standby)
• Separate power supply extends battery life
• Easy migration between u‑blox 2G, 3G, and 4G modules
• Supports eCall and ERA-GLONASS, CellLocate® indoor positioning, and GNSS / A-GNSS integration

• Industry proven SARA form factor
• Easy migration between u-blox 2G, 3G, LPWA (LTE-M and NB-IoT), LTE Cat.4 and LTE Cat.6 modules
• Simple integration with embedded Internet suite
• Optimized power consumption for IoT applications

• Ultra-low power consumption delivering 10+ years battery life, with excellent extended range in buildings underground (MCL 164 dB)
• Extended temperature range of -40°C to +85ºC and ISO/TS16949 manufacturing
• Easy migration between u-blox 2G, 3G, and 4G modules
• Very small SARA LGA form factor for easy manufacturing
• Support for both IP based and Non-IP based Small Data over NAS (SDoNAS)

• Ultra-low power consumption delivering 10+ years battery life
• Excellent extended range in buildings, underground (MCL 164dB)
• Extended temperature range of -40°C to +85°C and ISO/TS16949 manufacturing
• Easy migration between u blox 2G, 3G, and 4G modules
• Very small SARA LGA form factor for easy manufacturing
• Support for both IP based and Non-IP based Small Data over NAS (SDoNAS)

• Ultra-low power consumption delivering 10+ years battery life
• Excellent extended range in buildings, underground (MCL 164dB)
• Extended temperature range of -40°C to +85°C and ISO/TS16949 manufacturing
• Easy migration between u-blox 2G, 3G, and 4G modules
• Very small SARA LGA form factor for easy manufacturing
• Support for both IP based and Non-IP based Small Data over NAS (SDoNAS)

• Broad feature set enabling new IoT applications
• Ultra-low power consumption delivering 10+ years battery life
• Critical firmware updates delivered via uFOTA with LwM2M
• Easy migration between u-blox LTE-M and 2G modules
• Professional grade manufacturing (ISO/TS16949); qualified according to ISO 16750

• Ultra-compact LTE Cat.NB1 module with multi-regional coverage
• Configurable with a single hardware version
• Deliver critical firmware updates via uFOTA with LwM2M
• Low power consumption and longer battery life
• Extended range in buildings, basements and underground
• Easy migration between u-blox 2G, 3G, and 4G modules

• Global configurability with single hardware version
• LTE Cat M1/Cat NB1 multimode module with ultra-low power consumption
• Deliver critical firmware updates via uFOTA with LWM2M
• Easy migration between u-blox 2G, 3G and 4G modules

• LTE Cat M1/Cat NB1/ EGPRS multimode module with ultra-low power consumption
• Global configurability with single hardware version
• Delivers critical firmware updates via uFOTA with LWM2M
• Easy migration between u-blox 2G, 3G and 4G modules

• Always and everywhere location, integrated u-blox M8 GNSS receiver and CellLocate®
• Software-based configurability within each hardware design
• Simultaneous LTE communication with GNSS positioning
• Guaranteed best coverage with 23dBm output power
• Future-proof solutions via LwM2M and uFOTA

• Always and everywhere location, integrated u-blox M8 GNSS receiver and CellLocate®
• Software-based configurability within each hardware design
• Simultaneous LTE communication with GNSS positioning
• Guaranteed best coverage with 23dBm output power
• Future-proof solutions via LWM2M and uFOTA

• Always and everywhere location, integrated u-blox CellLocate®
• Software-based configurability within each hardware design
• Guaranteed best coverage with 23dBm output power
• Future-proof solutions via LwM2M and uFOTA

• UMTS/HSPA efficient and cost-effective module provide efficient high-speed mobile connectivity in an ultra-small LGA form factor
• Supports eCall, ERA‑GLONASS, CellLocate® indoor positioning, and GNSS / A‑GNSS integration
• Extended temperature range –40°C to +85°C and ISO/TS16949 manufacturing
• Automotive-grade and ATEX-certified options available
• Low power consumption and a rich feature set including dual-stack IPv4 / IPv6

• UMTS/HSPA efficient and cost-effective module provide efficient high-speed mobile connectivity in an ultra-small LGA form factor
• Supports eCall, ERA‑GLONASS, CellLocate® indoor positioning, and GNSS / A‑GNSS integration
• Extended temperature range –40°C to +85°C and ISO/TS16949 manufacturing
• Automotive-grade and ATEX-certified options available
• Low power consumption and a rich feature set including dual-stack IPv4 / IPv6

• Automotive grade available, qualified according to ISO 16750
• Compact TOBY LGA form factor for easy manufacturing
• Easy migration between u-blox 2G, 3G, and 4G modules
• 6 LTE bands Deliver critical firmware updates over the air
• Simple integration with the ELLA-W131 Wi-Fi module
• Extreme operating temperature range -40°C to +85°C

• Feature-rich IoT connectivity in smallest form factor with 2G fallback 
• Guaranteed best coverage with 23 dBm output power 
• Cost-effective, power efficient, end-to-end IoT communication with MQTT Anywhere and MQTT Flex 
• Always and everywhere location, with u-blox CellLocate 
• Better RF performance with configurable dynamic antenna tuning interface 

• Customer applications can run with uCPU on the UBX-R52 chipset 
• Delivers accurate and reliable positioning with the u-blox M10 GNSS receiver, concurrent with LTE 
• Power optimized and cost-effective positioning with SpotNow receiver 
• Cost-effective, power efficient, end-to-end IoT communication with MQTT Anywhere and MQTT Flex 

• Customer applications can run with uCPU on the UBX-R52 chipset 
• Delivers accurate and reliable positioning with the u-blox M10 GNSS receiver, concurrent with LTE 
• Power optimized and cost-effective positioning with SpotNow receiver 
• Cost-effective, power efficient, end-to-end IoT communication with MQTT Anywhere and MQTT Flex 

• Customer applications can run with uCPU on the UBX-R52 chipset 
• Delivers accurate and reliable positioning with the u-blox M10 GNSS receiver, concurrent with LTE 
• Power optimized and cost-effective positioning with SpotNow receiver 
• Cost-effective, power efficient, end-to-end IoT communication with MQTT Anywhere and MQTT Flex 

• Customer applications can run with uCPU on the UBX-R52 chipset 
• Delivers accurate and reliable positioning with the u-blox M10 GNSS receiver, concurrent with LTE 
• Power optimized and cost-effective positioning with SpotNow receiver 
• Cost-effective, power efficient, end-to-end IoT communication with MQTT Anywhere and MQTT Flex 

• Super small encapsulation size: 17.5mm x 15mm
• SMT surface-mount technology package
• Extended temperature range: -30°C to +85°C at full performance, down to -40°C at reduced performance

• Compact LTE-M/NB-IoT Cellular module design allows for implementation in small-size applications
• Provides AT-Command-based multi-band configurability, enabling international multi-regional coverage in LTE Cat.M1 / NB1 radio access technologies
• Includes a fully integrated global navigation satellite system solution that supports GPS and GLONASS positioning systems
• The ARM Cortex-M4 processor is exclusively for user application software, and it offers 1 MB of flash and 256 kB of RAM dedicated to this use

• 2G/LTE Cat.1bis chipset optimized for M2M and IoT applications
• Universal interfaces such as USB / UART / SPI / I2C / SDIO
• Ideal for medium and low rate communication solutions
• Support for frequency bands of major operators in Europe
• VoLTE support
• Ultra-low power solutions

• Best in class NB-IOT modem IP integrated with GNSS receiver
• Supports 3GPP^TM Release 14, Category NB1/NB2
• Supports enhanced coverage modes
• Ultra-low power consumption and tiny footprint to support cost-optimized solutions
• Highly integrated SoC: single die includes RF transceiver, PA, PMU, modem DSP, GNSS, SRAM, embedded Flash
• Release 15 ready with firmware update
• Optional support for: TLS, DTLS, HTTP, MQTT, CoAP, MQTT-SN, LwM2M

• 3GPP^TM NB-IoT Rel-14, incl. Rel-15 readiness
• Ultra Low Power Cortex-M4F AP w/ FPU
• Integrated SIM with certified security
• Advanced Communication processing (CP) engine
• Wide range voltage input from 1.7 V to 4.35 V
• OpenCPU solution with MCU-style SDK and tool set

• Single-die, SoC chip-integrated MCU/BB/RF/PMU/Flash/SRAM
• VFBGA (5.3 x 5.3) mm
• Ultra-low power standby mode (typically 12 μW including memory retention)
• Up to +20 dB extended coverage compared to GPRS (164 dB MCL)
• Supports 3GPP Rel.13 NB-IoT air interfaces and protocols
• Up to 20 PIOs on up to three (externally provided) supplies
• Dedicated application process with on-chip memory
• Extended temperature range of -40°C to +85°C
• Operates over 698-960 MHz
• UDP/IP
• Non-IP based Small Data over NAS and SMS

• Single-die, SoC chip-integrated MCU/BB/RF/PMU/Flash/SRAM
• 5.8mm x 5.8mm, 121-pin TFBGA
• Up to +20 dB extended coverage compared to GPRS (164 dB MCL)
• Supports 3GPP^TM Rel.13/14 NB-IoT air interfaces and protocols
• 40 configurable GPIOs 
• Operating temp range of -40°C to 85°C
• Standby Power Consumption typically 12uW including memory retention
• Dedicated application process with on-chip memory
• Operates over 698-960 MHz and 1710-2180 MHz
• CoAP over UDP/IP, IPv4/6
• Non-IP based small data over NAS and SMS
• No-harm to network: TS.34 Radio Policy Manager (RPM)

• Industry’s Smallest NB-IoT Module (16 mm x 18 mm) with integrated PMU, Baseband, RF, Modem DSP
• Ultra-low power, 3GPP^TM Release.13/14 (ready) NB-IoT platform for wide-ranging home, civic, industrial or mobile applications
• Single Core ARM Cortex-M (104 MHz), FPU + 4 MB PSRAM + 4 MB NOR Flash
• Global Radio Frequency Support: 450-2100 MHz
• Multi IO Interface support: I2C, I2S, PCM, SDIO, UART
• With a Real time operation system (RTOS), it’s easily customizable for applications such as home automation, cloud beacons, smart metering
• Future-proof with OTA upgrade

• Highly integrated, BGA form factor NB-IoT chip (both 3GPP Rel.13 and Rel.14), with ultra-small size: 5.8 mm x 5.4 mm
• Features a light-weight ARM Cortex-M0 application processor, a NB-IoT and GNSS modem DSP subsystem, a low-power RF transceiver, a multi-band RF front end, and power management unit (PMU)
• Designed for low data rates, ultra-low power, long distance, and massive connections of IoT applications
• Versatile network protocols and various low power modes
• Enables IoT devices for a wide range of applications from smart metering, intelligent agriculture, asset tracking, smart wearable devices, to M2M connections

• 3G / LTE / 5G M.2 module based on the Qualcomm SDX72 chipset
• Both 5G modes: NSA and SA supported
• Supports a wide range of supported LTE/5G NR frequency bands commonly used in different regions of the world
• Downlink/Uplink MIMO (4x4 / 2x2), ENDC / NR / LTE carrier aggregations
• Multi-constellation GNSS receiver available for applications requiring fast and accurate fixes in any environment

• Integrated GNSS Supports GPS, Glonass, BeiDou, Galileo
• Integrated Cortex A7 processor, Supports ThreadX and AliOS Things RTOS
• Hardened Security, Secure boot/debug, storage, key provsioning, Trusted Execution Environment
• One hardware design supporting: eMTC/Cat-M1, NB-IoT/Cat-NB2, E-GPRS
• One software: Image no matter what technology is used
• One RF: Extended frequency range support
• from 450MHz to 2.1GHz supporting >23 global bands

• Gobal multi-mode connectivity solution for IoT, supporting 15 LTE spectrum bands
• One hardware design, supporting the high reliability, low latency, and voice support of LTE Cat.M1 (eMTC) with the extended coverage and delay tolerance of Cat.NB1 (NB-IoT), together with E-GPRS
• Integrated GNSS (GPS, GLONASS, BeiDou/Compass, Galileo, QZSS)
• Single SKU allowing device manufacturers to support ultra-low power consumption and cost-optimized solutions of carriers/end-users worldwide
• Futureproof with OTA upgrade

• Global single-mode Rel.14 NB2 (NB-IoT) enabling extended coverage for delay tolerant applications
• Ultra-low power with sub 1µA sleep current
• Integrated RF transceiver and RF front end enabling RF frequency bands from 700MHz to 2.1GHz
• Integrated ARM Cortex M3 application processor
• Single chip solution includes modem baseband, memory, RF transceiver with fully integrated RF front end, and power management units enabling sub 100sq mm modules
• Comprehensive set of IoT networking protocols

• Global LTE Cat 1bis with a Wi-Fi receiver for indoor positioning
• Ultra-low power with sub 2µA sleep current
• Integrated LTE modem and RF transceiver and RF front end enabling RF frequency bands from 700MHz to 2.6GHz
• Integrated dual core ARM Cortex M3 application processor
• Support for external RF front end like Qualcomm QPA8675 multiband PA
• Support for indoor position location with 2.4 GHz Wi-Fi Scanning capability using a shared RX with LTE
• Comprehensive set of IoT networking protocols

• LTE IOT modem with GSMA approved and highly secure integrated SIM or iSIM that obviates the need for eSIM/SIM to reduce TCO
• Ultra low power: ~1.5 uA in PSM and < 10 uA in eDRX mode
• Qualified for industrial use cases as the silicon support junction temperature of 105C
• Global RF band support: 600 MHz to 2.7 GHz
• Extremely secure due to support for secure boot, secure storage, hardware based cryptography
• In-built support for WiFi and cellular based positioning and support precise GNSS positioning using external GNSS receiver

• Ultra small 20 mm x 21 mm x 1.5 mm LGA form factor
• World-wide band support in a Single SKU^TM design
• Lowest power consumption with 1 microAmp PSM
• eco-Paging^TM for optimized eDRX
• Power class options 20 dBm and 23 dBm
• On-modem location based services

• 3GPP^TM LTE Release 14/15 Cat.M1
• New tiny "S" LGA module form factor, with single-rail power supply supporting 2.2–5.5V
• Programmable RF filtering for global band support in a Single-SKU design (617 MHz to 2.2 GHz)
• Adaptive output power of +23dBm, +20dBm and +14dBm, for most efficient deep indoor penetration
• Fully tested and calibrated for easy integration into product hardware
• Fully software-compatible with first generation Monarch GM01Q (LTE-M), enabling ease of migration

• Ultra small 20 mm x 21 mm x 1.5 mm LGA form factor
• World-wide band support in a Single SKU^TM design
• Lowest power consumption with 1 microAmp PSM
• eco-Paging^TM for optimized eDRX
• Power class options 20 dBm and 23 dBm
• On-modem location based services

• 3GPP^TM LTE Release 14/15 Cat.M1
• New tiny "S" LGA form factor, with single-rail power supply supporting 2.2–5.5V
• Programmable RF filtering for global band support in a Single-SKU design (617 MHz to 2.2 GHz)
• Adaptive output power of +23dBm, +20dBm and +14dBm, for most efficient deep indoor penetration
• Fully tested and calibrated for easy integration into product hardware
• Fully software-compatible with first generation Monarch GM01Q (LTE-M), enabling ease of migration

• Cat.M1 and Cat.NB2 supported
• HFDD (Half Duplex FDD) and TDD
• 3GPP^TM Rel.13 features including eDRX, PSM, Enhanced Coverage (EC) Modes A and B
• Integrated voice processing for VoLTE and Voice over the top applications
• Secure boot and a robust hardware-based security framework
• Carrier grade integrated SIM
• OneSKU^TM frequency range 617 - 960 MHz and 1700 - 2200 MHz, optional support for 450 MHz Bands 31, 72, 73
• GNSS technologies: Assisted GPS and GLONASS
• Cellular based location
• Interfaces include: UART (3), SPI, FS USB2.0, USIM(2) or eUICC, I2S/PCM audio, GPIOs, I2C, Auxiliary ADC and PWM
• WLCSP packaging for low cost and small size devices

• The most integrated, cost optimized NB-IoT chipset with 2G fallback available in the market
• Compliant with 3GPP^TM Rel.13/14 and software upgradeable to Rel.15, enabling a wide set of Cellular IoT features, global coverage, and outstanding performance
• Integrates an LTE baseband processor, RF transceiver, memory, cellular based location engine, MCU subsystem, and a hardware based integrated SIM (iSIM)
• Provides out-of-the-box secure cloud connectivity, using MQTT, COAP and LwM2M
• Enables miniature complete modules of less than 10x10mm, targeted for power and size sensitive applications
• Features ultra-low power consumption in a variety of modes, including PSM and eDRX, for optimized power and over 15 years of battery life in real life applications
• The integrated Cortex M4 MCU in ALT1255 is designed to serve a wide range of customer applications

• 3GPP^TM Release 13 NB-IoT specification fully-compliant
• Software upgradeable to support 3GPP^TM Release 14 features
• Wide frequency range of supported RF bands
• Supports all deployment scenarios (standalone, in-band, guard-band), single-tone and multi-tone in uplink
• Supports CP-CIoT and UP-CIoT
• Power saving features, including PSM and eDRX, with multiple SoC low power modes
• Up to 192MHz MIPS processor, integraion 32Mb SPI NOR flash and pSRAM

• High performance, highly integrated system-on-chip processor with NB-IoT connectivity and 2G Fallback
• Integrates all essential electronic components, including baseband, multi-band RF transceiver, and a power management unit
• Packed with impressive connectivity for easy scalability of the system, allowing glue less interfaces to camera and multimedia companion chips, SDMMC Memory Cards and SPI devices, LCD modules, and USB
• GPRS Class 12 enabled, and supports Full Rate (FR), Half Rate (HR), Enhanced Full Rate (EFR) voice coders
• Supports simultaneous dual network operation and integrates a SIM controller with integrated level shifters that can support two SIM cards
• Available in a small footprint, fine pitch, 8.5 mm x 9.0 mm TFBGA package

• 2G/LTE Cat.1 bis chipset optimized for M2M and IoT applications
• Universal interfaces such as USB / UART / SPI / I²C / SDIO
• Ideal for medium and low rate communication solution
• Support for frequency bands of major European networks
• Flexible I/O voltage
• Ultra-low power standby solution, embedded power-FSM

• UIS8811 is an advanced system-on-chip solution that integrates a low-power NB-IOT modem that supports a wide range of frequencies and voltages 
• Supports wide range of frequency bands