Chipsets
Selecting the right chipset is fundamental to the performance, efficiency, and longevity of IoT devices. By relying on proven chipset technologies, customers can reduce development complexity, ensure network compatibility, and accelerate time-to-market while building future-proof IoT solutions.
Chipset
ASR1603
KEY SELLING POINTS
- 2G/LTE Cat.1bis chipset optimized for M2M and IoT applications
- Universal interfaces such as USB / UART / SPI / I2C / SDIO
- Ideal for medium and low rate communication solutions
- Support for frequency bands of major operators in Europe
- VoLTE support
- Ultra-low power solutions
Chipset
Dragonfly
KEY SELLING POINTS
- Best in class NB-IOT modem IP integrated with GNSS receiver
- Supports 3GPPTM Release 14, Category NB1/NB2
- Supports enhanced coverage modes
- Ultra-low power consumption and tiny footprint to support cost-optimized solutions
- Highly integrated SoC: single die includes RF transceiver, PA, PMU, modem DSP, GNSS, SRAM, embedded Flash
- Release 15 ready with firmware update
- Optional support for: TLS, DTLS, HTTP, MQTT, CoAP, MQTT-SN, LwM2M
Chipset
GR851X
KEY SELLING POINTS
- 3GPPTM NB-IoT Rel-14, incl. Rel-15 readiness
- Ultra Low Power Cortex-M4F AP w/ FPU
- Integrated SIM with certified security
- Advanced Communication processing (CP) engine
- Wide range voltage input from 1.7 V to 4.35 V
- OpenCPU solution with MCU-style SDK and tool set
Chipset
Hi2115V110
KEY SELLING POINTS
- Single-die, SoC chip-integrated MCU/BB/RF/PMU/Flash/SRAM
- 5.8mm x 5.8mm, 121-pin TFBGA
- Up to +20 dB extended coverage compared to GPRS (164 dB MCL)
- Supports 3GPPTM Rel.13/14 NB-IoT air interfaces and protocols
- 40 configurable GPIOs
- Operating temp range of -40°C to 85°C
- Standby Power Consumption typically 12uW including memory retention
- Dedicated application process with on-chip memory
- Operates over 698-960 MHz and 1710-2180 MHz
- CoAP over UDP/IP, IPv4/6
- Non-IP based small data over NAS and SMS
- No-harm to network: TS.34 Radio Policy Manager (RPM)
Chipset
Hi2110V120
KEY SELLING POINTS
- Single-die, SoC chip-integrated MCU/BB/RF/PMU/Flash/SRAM
- VFBGA (5.3 x 5.3) mm
- Ultra-low power standby mode (typically 12 μW including memory retention)
- Up to +20 dB extended coverage compared to GPRS (164 dB MCL)
- Supports 3GPP Rel.13 NB-IoT air interfaces and protocols
- Up to 20 PIOs on up to three (externally provided) supplies
- Dedicated application process with on-chip memory
- Extended temperature range of -40°C to +85°C
- Operates over 698-960 MHz
- UDP/IP
- Non-IP based Small Data over NAS and SMS
Chipset
MT2625
KEY SELLING POINTS
- Industry’s Smallest NB-IoT Module (16 mm x 18 mm) with integrated PMU, Baseband, RF, Modem DSP
- Ultra-low power, 3GPPTM Release.13/14 (ready) NB-IoT platform for wide-ranging home, civic, industrial or mobile applications
- Single Core ARM Cortex-M (104 MHz), FPU + 4 MB PSRAM + 4 MB NOR Flash
- Global Radio Frequency Support: 450-2100 MHz
- Multi IO Interface support: I2C, I2S, PCM, SDIO, UART
- With a Real time operation system (RTOS), it’s easily customizable for applications such as home automation, cloud beacons, smart metering
- Future-proof with OTA upgrade
Chipset
NK6010P1
KEY SELLING POINTS
- Highly integrated, BGA form factor NB-IoT chip (both 3GPP Rel.13 and Rel.14), with ultra-small size: 5.8 mm x 5.4 mm
- Features a light-weight ARM Cortex-M0 application processor, a NB-IoT and GNSS modem DSP subsystem, a low-power RF transceiver, a multi-band RF front end, and power management unit (PMU)
- Designed for low data rates, ultra-low power, long distance, and massive connections of IoT applications
- Versatile network protocols and various low power modes
- Enables IoT devices for a wide range of applications from smart metering, intelligent agriculture, asset tracking, smart wearable devices, to M2M connections
Chipset
MDM9206 TX
KEY SELLING POINTS
- Gobal multi-mode connectivity solution for IoT, supporting 15 LTE spectrum bands
- One hardware design, supporting the high reliability, low latency, and voice support of LTE Cat.M1 (eMTC) with the extended coverage and delay tolerance of Cat.NB1 (NB-IoT), together with E-GPRS
- Integrated GNSS (GPS, GLONASS, BeiDou/Compass, Galileo, QZSS)
- Single SKU allowing device manufacturers to support ultra-low power consumption and cost-optimized solutions of carriers/end-users worldwide
- Futureproof with OTA upgrade
Chipset
MDM9205 TX
KEY SELLING POINTS
- Integrated GNSS Supports GPS, Glonass, BeiDou, Galileo
- Integrated Cortex A7 processor, Supports ThreadX and AliOS Things RTOS
- Hardened Security, Secure boot/debug, storage, key provsioning, Trusted Execution Environment
- One hardware design supporting: eMTC/Cat-M1, NB-IoT/Cat-NB2, E-GPRS
- One software: Image no matter what technology is used
- One RF: Extended frequency range support
- from 450MHz to 2.1GHz supporting >23 global bands
Chipset
QCX212
KEY SELLING POINTS
- Global single-mode Rel.14 NB2 (NB-IoT) enabling extended coverage for delay tolerant applications
- Ultra-low power with sub 1µA sleep current
- Integrated RF transceiver and RF front end enabling RF frequency bands from 700MHz to 2.1GHz
- Integrated ARM Cortex M3 application processor
- Single chip solution includes modem baseband, memory, RF transceiver with fully integrated RF front end, and power management units enabling sub 100sq mm modules
- Comprehensive set of IoT networking protocols
Chipset
QCX216
KEY SELLING POINTS
- Global LTE Cat 1bis with a Wi-Fi receiver for indoor positioning
- Ultra-low power with sub 2µA sleep current
- Integrated LTE modem and RF transceiver and RF front end enabling RF frequency bands from 700MHz to 2.6GHz
- Integrated dual core ARM Cortex M3 application processor
- Support for external RF front end like Qualcomm QPA8675 multiband PA
- Support for indoor position location with 2.4 GHz Wi-Fi Scanning capability using a shared RX with LTE
- Comprehensive set of IoT networking protocols
Chipset
QCX217
KEY SELLING POINTS
- LTE IOT modem with GSMA approved and highly secure integrated SIM or iSIM that obviates the need for eSIM/SIM to reduce TCO
- Ultra low power: ~1.5 uA in PSM and < 10 uA in eDRX mode
- Qualified for industrial use cases as the silicon support junction temperature of 105C
- Global RF band support: 600 MHz to 2.7 GHz
- Extremely secure due to support for secure boot, secure storage, hardware based cryptography
- In-built support for WiFi and cellular based positioning and support precise GNSS positioning using external GNSS receiver
Chipset
Monarch SQN3330-M1
KEY SELLING POINTS
- Ultra small 20 mm x 21 mm x 1.5 mm LGA form factor
- World-wide band support in a Single SKUTM design
- Lowest power consumption with 1 microAmp PSM
- eco-PagingTM for optimized eDRX
- Power class options 20 dBm and 23 dBm
- On-modem location based services
Chipset
Monarch 2 SQN3430-M1
KEY SELLING POINTS
- 3GPPTM LTE Release 14/15 Cat.M1
- New tiny "S" LGA form factor, with single-rail power supply supporting 2.2–5.5V
- Programmable RF filtering for global band support in a Single-SKU design (617 MHz to 2.2 GHz)
- Adaptive output power of +23dBm, +20dBm and +14dBm, for most efficient deep indoor penetration
- Fully tested and calibrated for easy integration into product hardware
- Fully software-compatible with first generation Monarch GM01Q (LTE-M), enabling ease of migration
Chipset
ALT1250
KEY SELLING POINTS
- Cat.M1 and Cat.NB2 supported
- HFDD (Half Duplex FDD) and TDD
- 3GPPTM Rel.13 features including eDRX, PSM, Enhanced Coverage (EC) Modes A and B
- Integrated voice processing for VoLTE and Voice over the top applications
- Secure boot and a robust hardware-based security framework
- Carrier grade integrated SIM
- OneSKUTM frequency range 617 - 960 MHz and 1700 - 2200 MHz, optional support for 450 MHz Bands 31, 72, 73
- GNSS technologies: Assisted GPS and GLONASS
- Cellular based location
- Interfaces include: UART (3), SPI, FS USB2.0, USIM(2) or eUICC, I2S/PCM audio, GPIOs, I2C, Auxiliary ADC and PWM
- WLCSP packaging for low cost and small size devices
Chipset
ALT1255
KEY SELLING POINTS
- The most integrated, cost optimized NB-IoT chipset with 2G fallback available in the market
- Compliant with 3GPPTM Rel.13/14 and software upgradeable to Rel.15, enabling a wide set of Cellular IoT features, global coverage, and outstanding performance
- Integrates an LTE baseband processor, RF transceiver, memory, cellular based location engine, MCU subsystem, and a hardware based integrated SIM (iSIM)
- Provides out-of-the-box secure cloud connectivity, using MQTT, COAP and LwM2M
- Enables miniature complete modules of less than 10x10mm, targeted for power and size sensitive applications
- Features ultra-low power consumption in a variety of modes, including PSM and eDRX, for optimized power and over 15 years of battery life in real life applications
- The integrated Cortex M4 MCU in ALT1255 is designed to serve a wide range of customer applications
Chipset
IVY8908A
KEY SELLING POINTS
- 3GPPTM Release 13 NB-IoT specification fully-compliant
- Software upgradeable to support 3GPPTM Release 14 features
- Wide frequency range of supported RF bands
- Supports all deployment scenarios (standalone, in-band, guard-band), single-tone and multi-tone in uplink
- Supports CP-CIoT and UP-CIoT
- Power saving features, including PSM and eDRX, with multiple SoC low power modes
- Up to 192MHz MIPS processor, integraion 32Mb SPI NOR flash and pSRAM
Chipset
UIS8811
KEY SELLING POINTS
N/A
Chipset
IVY8909B
KEY SELLING POINTS
- High performance, highly integrated system-on-chip processor with NB-IoT connectivity and 2G Fallback
- Integrates all essential electronic components, including baseband, multi-band RF transceiver, and a power management unit
- Packed with impressive connectivity for easy scalability of the system, allowing glue less interfaces to camera and multimedia companion chips, SDMMC Memory Cards and SPI devices, LCD modules, and USB
- GPRS Class 12 enabled, and supports Full Rate (FR), Half Rate (HR), Enhanced Full Rate (EFR) voice coders
- Supports simultaneous dual network operation and integrates a SIM controller with integrated level shifters that can support two SIM cards
- Available in a small footprint, fine pitch, 8.5 mm x 9.0 mm TFBGA package
Chipset
UIS8910DM
KEY SELLING POINTS
- 2G/LTE Cat.1 bis chipset optimized for M2M and IoT applications
- Universal interfaces such as USB / UART / SPI / I2C / SDIO
- Ideal for medium and low rate communication solution
- Support for frequency bands of major European networks
- Flexible I/O voltage
- Ultra-low power standby solution, embedded power-FSM