Chipsätze
Die Auswahl des richtigen Chipsets ist grundlegend für die Leistungsfähigkeit, Effizienz und Langlebigkeit von IoT-Geräten. Durch den Einsatz bewährter Chipset-Technologien können Kunden die Entwicklungskomplexität reduzieren, die Netzkompatibilität sicherstellen und die Markteinführungszeit verkürzen, während sie zukunftssichere IoT-Lösungen entwickeln.
Chipset
ASR1603
HAUPTVERKAUFSARGUMENTE
- 2G/LTE Cat.1bis chipset optimized for M2M and IoT applications
- Universal interfaces such as USB / UART / SPI / I2C / SDIO
- Ideal for medium and low rate communication solutions
- Support for frequency bands of major operators in Europe
- VoLTE support
- Ultra-low power solutions
Chipset
Dragonfly
HAUPTVERKAUFSARGUMENTE
- Best in class NB-IOT modem IP integrated with GNSS receiver
- Supports 3GPPTM Release 14, Category NB1/NB2
- Supports enhanced coverage modes
- Ultra-low power consumption and tiny footprint to support cost-optimized solutions
- Highly integrated SoC: single die includes RF transceiver, PA, PMU, modem DSP, GNSS, SRAM, embedded Flash
- Release 15 ready with firmware update
- Optional support for: TLS, DTLS, HTTP, MQTT, CoAP, MQTT-SN, LwM2M
Chipset
GR851X
HAUPTVERKAUFSARGUMENTE
- 3GPPTM NB-IoT Rel-14, incl. Rel-15 readiness
- Ultra Low Power Cortex-M4F AP w/ FPU
- Integrated SIM with certified security
- Advanced Communication processing (CP) engine
- Wide range voltage input from 1.7 V to 4.35 V
- OpenCPU solution with MCU-style SDK and tool set
Chipset
Hi2115V110
HAUPTVERKAUFSARGUMENTE
- Single-die, SoC chip-integrated MCU/BB/RF/PMU/Flash/SRAM
- 5.8mm x 5.8mm, 121-pin TFBGA
- Up to +20 dB extended coverage compared to GPRS (164 dB MCL)
- Supports 3GPPTM Rel.13/14 NB-IoT air interfaces and protocols
- 40 configurable GPIOs
- Operating temp range of -40°C to 85°C
- Standby Power Consumption typically 12uW including memory retention
- Dedicated application process with on-chip memory
- Operates over 698-960 MHz and 1710-2180 MHz
- CoAP over UDP/IP, IPv4/6
- Non-IP based small data over NAS and SMS
- No-harm to network: TS.34 Radio Policy Manager (RPM)
Chipset
Hi2110V120
HAUPTVERKAUFSARGUMENTE
- Single-die, SoC chip-integrated MCU/BB/RF/PMU/Flash/SRAM
- VFBGA (5.3 x 5.3) mm
- Ultra-low power standby mode (typically 12 μW including memory retention)
- Up to +20 dB extended coverage compared to GPRS (164 dB MCL)
- Supports 3GPP Rel.13 NB-IoT air interfaces and protocols
- Up to 20 PIOs on up to three (externally provided) supplies
- Dedicated application process with on-chip memory
- Extended temperature range of -40°C to +85°C
- Operates over 698-960 MHz
- UDP/IP
- Non-IP based Small Data over NAS and SMS
Chipset
MT2625
HAUPTVERKAUFSARGUMENTE
- Industry’s Smallest NB-IoT Module (16 mm x 18 mm) with integrated PMU, Baseband, RF, Modem DSP
- Ultra-low power, 3GPPTM Release.13/14 (ready) NB-IoT platform for wide-ranging home, civic, industrial or mobile applications
- Single Core ARM Cortex-M (104 MHz), FPU + 4 MB PSRAM + 4 MB NOR Flash
- Global Radio Frequency Support: 450-2100 MHz
- Multi IO Interface support: I2C, I2S, PCM, SDIO, UART
- With a Real time operation system (RTOS), it’s easily customizable for applications such as home automation, cloud beacons, smart metering
- Future-proof with OTA upgrade
Chipset
NK6010P1
HAUPTVERKAUFSARGUMENTE
- Highly integrated, BGA form factor NB-IoT chip (both 3GPP Rel.13 and Rel.14), with ultra-small size: 5.8 mm x 5.4 mm
- Features a light-weight ARM Cortex-M0 application processor, a NB-IoT and GNSS modem DSP subsystem, a low-power RF transceiver, a multi-band RF front end, and power management unit (PMU)
- Designed for low data rates, ultra-low power, long distance, and massive connections of IoT applications
- Versatile network protocols and various low power modes
- Enables IoT devices for a wide range of applications from smart metering, intelligent agriculture, asset tracking, smart wearable devices, to M2M connections
Chipset
MDM9206 TX
HAUPTVERKAUFSARGUMENTE
- Gobal multi-mode connectivity solution for IoT, supporting 15 LTE spectrum bands
- One hardware design, supporting the high reliability, low latency, and voice support of LTE Cat.M1 (eMTC) with the extended coverage and delay tolerance of Cat.NB1 (NB-IoT), together with E-GPRS
- Integrated GNSS (GPS, GLONASS, BeiDou/Compass, Galileo, QZSS)
- Single SKU allowing device manufacturers to support ultra-low power consumption and cost-optimized solutions of carriers/end-users worldwide
- Futureproof with OTA upgrade
Chipset
MDM9205 TX
HAUPTVERKAUFSARGUMENTE
- Integrated GNSS Supports GPS, Glonass, BeiDou, Galileo
- Integrated Cortex A7 processor, Supports ThreadX and AliOS Things RTOS
- Hardened Security, Secure boot/debug, storage, key provsioning, Trusted Execution Environment
- One hardware design supporting: eMTC/Cat-M1, NB-IoT/Cat-NB2, E-GPRS
- One software: Image no matter what technology is used
- One RF: Extended frequency range support
- from 450MHz to 2.1GHz supporting >23 global bands
Chipset
QCX212
HAUPTVERKAUFSARGUMENTE
- Global single-mode Rel.14 NB2 (NB-IoT) enabling extended coverage for delay tolerant applications
- Ultra-low power with sub 1µA sleep current
- Integrated RF transceiver and RF front end enabling RF frequency bands from 700MHz to 2.1GHz
- Integrated ARM Cortex M3 application processor
- Single chip solution includes modem baseband, memory, RF transceiver with fully integrated RF front end, and power management units enabling sub 100sq mm modules
- Comprehensive set of IoT networking protocols
Chipset
QCX216
HAUPTVERKAUFSARGUMENTE
- Global LTE Cat 1bis with a Wi-Fi receiver for indoor positioning
- Ultra-low power with sub 2µA sleep current
- Integrated LTE modem and RF transceiver and RF front end enabling RF frequency bands from 700MHz to 2.6GHz
- Integrated dual core ARM Cortex M3 application processor
- Support for external RF front end like Qualcomm QPA8675 multiband PA
- Support for indoor position location with 2.4 GHz Wi-Fi Scanning capability using a shared RX with LTE
- Comprehensive set of IoT networking protocols
Chipset
QCX217
HAUPTVERKAUFSARGUMENTE
- LTE IOT modem with GSMA approved and highly secure integrated SIM or iSIM that obviates the need for eSIM/SIM to reduce TCO
- Ultra low power: ~1.5 uA in PSM and < 10 uA in eDRX mode
- Qualified for industrial use cases as the silicon support junction temperature of 105C
- Global RF band support: 600 MHz to 2.7 GHz
- Extremely secure due to support for secure boot, secure storage, hardware based cryptography
- In-built support for WiFi and cellular based positioning and support precise GNSS positioning using external GNSS receiver
Chipset
Monarch SQN3330-M1
HAUPTVERKAUFSARGUMENTE
- Ultra small 20 mm x 21 mm x 1.5 mm LGA form factor
- World-wide band support in a Single SKUTM design
- Lowest power consumption with 1 microAmp PSM
- eco-PagingTM for optimized eDRX
- Power class options 20 dBm and 23 dBm
- On-modem location based services
Chipset
Monarch 2 SQN3430-M1
HAUPTVERKAUFSARGUMENTE
- 3GPPTM LTE Release 14/15 Cat.M1
- New tiny "S" LGA form factor, with single-rail power supply supporting 2.2–5.5V
- Programmable RF filtering for global band support in a Single-SKU design (617 MHz to 2.2 GHz)
- Adaptive output power of +23dBm, +20dBm and +14dBm, for most efficient deep indoor penetration
- Fully tested and calibrated for easy integration into product hardware
- Fully software-compatible with first generation Monarch GM01Q (LTE-M), enabling ease of migration
Chipset
ALT1250
HAUPTVERKAUFSARGUMENTE
- Cat.M1 and Cat.NB2 supported
- HFDD (Half Duplex FDD) and TDD
- 3GPPTM Rel.13 features including eDRX, PSM, Enhanced Coverage (EC) Modes A and B
- Integrated voice processing for VoLTE and Voice over the top applications
- Secure boot and a robust hardware-based security framework
- Carrier grade integrated SIM
- OneSKUTM frequency range 617 - 960 MHz and 1700 - 2200 MHz, optional support for 450 MHz Bands 31, 72, 73
- GNSS technologies: Assisted GPS and GLONASS
- Cellular based location
- Interfaces include: UART (3), SPI, FS USB2.0, USIM(2) or eUICC, I2S/PCM audio, GPIOs, I2C, Auxiliary ADC and PWM
- WLCSP packaging for low cost and small size devices
Chipset
ALT1255
HAUPTVERKAUFSARGUMENTE
- The most integrated, cost optimized NB-IoT chipset with 2G fallback available in the market
- Compliant with 3GPPTM Rel.13/14 and software upgradeable to Rel.15, enabling a wide set of Cellular IoT features, global coverage, and outstanding performance
- Integrates an LTE baseband processor, RF transceiver, memory, cellular based location engine, MCU subsystem, and a hardware based integrated SIM (iSIM)
- Provides out-of-the-box secure cloud connectivity, using MQTT, COAP and LwM2M
- Enables miniature complete modules of less than 10x10mm, targeted for power and size sensitive applications
- Features ultra-low power consumption in a variety of modes, including PSM and eDRX, for optimized power and over 15 years of battery life in real life applications
- The integrated Cortex M4 MCU in ALT1255 is designed to serve a wide range of customer applications
Chipset
IVY8908A
HAUPTVERKAUFSARGUMENTE
- 3GPPTM Release 13 NB-IoT specification fully-compliant
- Software upgradeable to support 3GPPTM Release 14 features
- Wide frequency range of supported RF bands
- Supports all deployment scenarios (standalone, in-band, guard-band), single-tone and multi-tone in uplink
- Supports CP-CIoT and UP-CIoT
- Power saving features, including PSM and eDRX, with multiple SoC low power modes
- Up to 192MHz MIPS processor, integraion 32Mb SPI NOR flash and pSRAM
Chipset
UIS8811
HAUPTVERKAUFSARGUMENTE
N/A
Chipset
IVY8909B
HAUPTVERKAUFSARGUMENTE
- High performance, highly integrated system-on-chip processor with NB-IoT connectivity and 2G Fallback
- Integrates all essential electronic components, including baseband, multi-band RF transceiver, and a power management unit
- Packed with impressive connectivity for easy scalability of the system, allowing glue less interfaces to camera and multimedia companion chips, SDMMC Memory Cards and SPI devices, LCD modules, and USB
- GPRS Class 12 enabled, and supports Full Rate (FR), Half Rate (HR), Enhanced Full Rate (EFR) voice coders
- Supports simultaneous dual network operation and integrates a SIM controller with integrated level shifters that can support two SIM cards
- Available in a small footprint, fine pitch, 8.5 mm x 9.0 mm TFBGA package
Chipset
UIS8910DM
HAUPTVERKAUFSARGUMENTE
- 2G/LTE Cat.1 bis chipset optimized for M2M and IoT applications
- Universal interfaces such as USB / UART / SPI / I2C / SDIO
- Ideal for medium and low rate communication solution
- Support for frequency bands of major European networks
- Flexible I/O voltage
- Ultra-low power standby solution, embedded power-FSM